Solid-state imaging device, solid-state imaging device manufacturing method, and electronic device

ABSTRACT

A solid-state imaging device includes: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of the semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of the semiconductor substrate; with impurity concentration of a connection face between the second first-electroconductive-type semiconductor region and the second second-electroconductive-type semiconductor region being equal to or greater than impurity concentration of a connection face of an opposite layer of the second first-electroconductive-type semiconductor region of the second second-electroconductive-type semiconductor region.

CROSS-REFERENCE PARAGRAPH

The present application is a continuation application of U.S. patentapplication Ser. No. 13/540,760, filed on Jul. 3, 2012, which claims thepriority from prior Japanese Priority Patent Application JP 2011-176057filed in the Japan Patent Office on Aug. 11, 2011, and prior JapanesePriority Patent Application JP 2011-153914 filed in the Japan PatentOffice on Jul. 12, 2011, the entire contents of which are herebyincorporated by reference.

BACKGROUND

The present technology relates to a solid-state imaging device, asolid-state imaging device manufacturing method, and an electronicdevice employing this solid-state imaging device.

With solid-state imaging devices having a photoelectric conversionregion, there is a solid-state imaging device having a configurationwherein multiple photoelectric conversion regions are disposed in thedepth direction of a semiconductor substrate. With such a solid-stateimaging device, a trench is formed in proximity to a photoelectricconversion region disposed in a depth position of the semiconductorsubstrate, and a readout gate is disposed within this trench via a gateinsulating film.

With the solid-state imaging device thus configured, a channel is formedin a position along the gate insulating film between the depth positionwhere the photoelectric conversion region is disposed and a floatingdiffusion within the semiconductor substrate. Signal charges accumulatedin the photoelectric conversion region are read out to the floatingdiffusion via this channel by applying voltage to a readout gateembedded in the trench (see Japanese Unexamined Patent ApplicationPublication No. 2009-295937).

Also, a configuration has been disclosed wherein a semiconductorsubstrate region where a channel between a photoelectric conversionregion having an n-type impurity region disposed in a depth position ofa semiconductor substrate and a floating diffusion made up of an n-typeimpurity region is formed is taken as an n-type impurity region havinglow concentration. With such a configuration, the photoelectricconversion region is completely depleted by adjusting the n-typeimpurity concentration, whereby all of the signal charges can betransferred (see Japanese Unexamined Patent Application Publication No.2010-114322).

Also, with regard to rear face irradiation type solid-state imagingdevices, improvement in saturation charge amount, and high sensitivityhave been demanded.

As a configuration for increasing saturation charge amount, asolid-state imaging device has been proposed wherein multiplephotodiodes are formed in the depth direction within a substrate (seeJapanese Unexamined Patent Application Publication No. 2010-114274).With this configuration, saturation charge amount is increased bylaminating three photodiodes (PD1, PD2, and PD3) formed with PN junctionbetween an n-type semiconductor region and a p-type semiconductor regionon the n-type semiconductor region in the depth direction. Additionally,a vertical-type gate electrode embedded in the depth direction from thesurface of the substrate is provided as a transfer transistor (Tr).Electric charges are transferred to the floating diffusion (FD) from aphotodiode PD formed in a depth position of the substrate using thisvertical-type Tr.

Also, as for a configuration for enabling high sensitivity, asolid-state imaging device has been proposed wherein a second photodiodePD2 is provided on the light incident side (substrate rear face), and afirst photodiode PD1 is provided on the opposite face (substrate frontface) on the light incident side (see Japanese Unexamined PatentApplication Publication No. 2010-192483).

With this solid-state imaging device, the first photodiode PD1 andfloating diffusion (FD) and so forth are formed by injecting ions intothe surface of the semiconductor substrate. Further, after forming agate electrode, a wiring layer, or the like on the semiconductorsubstrate, the semiconductor substrate is reversed, and the rear face ofthe semiconductor substrate is ground.

Next, ions are injected from the rear face side of the semiconductorsubstrate to perform activation of impurities by heat treatment of 1000°C. such as laser annealing or the like for example to form a secondphotodiode PD2 and so forth.

SUMMARY

However, with the solid-state imaging devices configured such asdescribed above, though all of the signal charges of a photoelectricconversion region disposed in a relatively shallow position within thesemiconductor substrate may be read out, it is difficult to read outsignal charges of a photoelectric conversion region positioned in a deepportion. This is because in the case of having turned on the readoutgate, a region of which the potential is deeper than a channel portionis formed in a portion in proximity to the gate insulating film in then-type impurity region making up the photoelectric conversion region,and signal charges are remained in this deep region. Such remaining ofsignal charges becomes a cause for generating an afterimage as to animaged image according to this solid-state imaging device. Also, withthe solid-state imaging device, further improvement in saturation chargeamount has been demanded.

Therefore, with the present technology, it has been found to bedesirable to provide a solid-state imaging device whereby all signalcharges of a photoelectric conversion region can be read out regardlessof deep positions of the semiconductor substrate, thereby realizingimprovement in imaging properties. Also, with the present technology, ithas been found to be desirable to provide a solid-state imaging devicewhereby improvement in saturation charge amount can be realized. Also,with the present technology, it has been found to be desirable toprovide a manufacturing method for such a solid-state imaging device,and an electronic device including such a solid-state imaging device.

A solid-state imaging device according to the present technologyincludes a readout gate embedded within a trench formed in asemiconductor substrate via a gate insulating film, and a photoelectricconversion region provided within the semiconductor substrate. Further,a floating diffusion is provided on the surface layer of thesemiconductor substrate while keeping an interval with the photoelectricconversion region. In particular, a potential adjustment region isprovided adjacent to the photoelectric conversion region and gateinsulating film. This potential adjustment region is the sameelectroconductive type as the semiconductor substrate and photoelectricconversion region, and is also an impurity region of which theelectroconductive-type concentration is lower than the semiconductorsubstrate and photoelectric conversion region.

With the solid-state imaging device having such a configuration, thesteps in potential decrease in a channel-formed region along the gateinsulating film as compared to a configuration where no potentialadjustment is provided. Also, for example, in the case that all of thephotoelectric conversion region, a region along the gate insulating filmin the semiconductor substrate, and the potential adjustment region arethe n-types, the potential of the semiconductor substrate is shallowerthan the potential adjustment region. Therefore, in the event of readingout signal charges (electrons) accumulated in the photoelectricconversion region to the potential adjustment region by applying voltageto the readout gate, the signal charges (electrons) are read out to thechannel-formed region of the semiconductor substrate along the gateinsulating film without disturbance.

Also, the present technology is also a manufacturing method for such asolids-state imaging device, and performs the following procedures.First, an impurity is introduced into the semiconductor substrate. Thus,a photoelectric conversion region is formed within the semiconductorsubstrate. Also, along with this, a potential adjustment region which isthe same electroconductive type as with the semiconductor substrate andphotoelectric conversion region, and is also low in the concentration ofthis electroconductive type as compared to the semiconductor substrateand photoelectric conversion region is formed adjacent to thephotoelectric conversion region. Next, a trench adjacent to thepotential adjustment region is formed in the semiconductor substrate.After this, a readout gate is formed within the trench via a gateinsulating film. Also, a floating diffusion is formed in proximity tothe readout gate by introducing an impurity into the surface layer ofthe semiconductor substrate.

Also, a solid-state imaging device according to the present technologyincludes a first photodiode made up of a firstfirst-electroconductive-type semiconductor region formed on a firstprincipal face side of a semiconductor substrate, and a firstsecond-electroconductive-type semiconductor region formed within thesemiconductor substrate adjacent to the firstfirst-electroconductive-type semiconductor region, and a secondphotodiode made up of a second second-electroconductive-typesemiconductor region formed on a second principal face side of thesemiconductor substrate, and a second second-electroconductive-typesemiconductor region formed within the semiconductor substrate adjacentto the second first-electroconductive-type semiconductor region, andalso includes a gate electrode formed on the first principal face sideof the semiconductor substrate. With the above configuration, impurityconcentration of a connection face between the secondfirst-electroconductive-type semiconductor region and the secondsecond-electroconductive-type semiconductor region is equal to orgreater than impurity concentration of a connection face of an oppositelayer of the second first-electroconductive-type semiconductor region ofthe second second-electroconductive-type semiconductor region.

Alternatively, with the above configuration, the firstsecond-electroconductive-type semiconductor region and the secondsecond-electroconductive-type semiconductor region are connected withinthe semiconductor substrate. Also, the impurity concentration of aconnection face between the second first-electroconductive-typesemiconductor region and the second second-electroconductive-typesemiconductor region is equal to or smaller than impurity concentrationof a connection face between the first second-electroconductive-typesemiconductor region of the second second-electroconductive-typesemiconductor region.

Also, the electronic device according to the present technology includesthe above solid-state imaging device, and an optical system configuredto guide incident light into an imaging unit of the solid-state imagingdevice, and a signal processing circuit configured to process an outputsignal of the solid-state imaging device.

A solid-state imaging device manufacturing method according to thepresent technology includes: injecting a second-electroconductive-typeimpurity from the first principal face side of a semiconductor substrateto form a first second-electroconductive-type semiconductor regionwithin the first principal face side of the semiconductor substrate;injecting a first-electroconductive-type impurity from the firstprincipal face side of the semiconductor substrate to form a firstfirst-electroconductive-type semiconductor region on the surface of thefirst principal face of the semiconductor substrate; forming a gateelectrode on the first principal face of the semiconductor substrate;injecting a second-electroconductive-type impurity from the secondprincipal face side of the semiconductor substrate to form a secondsecond-electroconductive-type semiconductor region within the secondprincipal face side of the semiconductor substrate, of which theimpurity concentration on the surface side of the second principal faceis equal to or greater than impurity concentration on the deep portionside of the semiconductor substrate; and injecting afirst-electroconductive-type impurity from the second principal faceside of the semiconductor substrate to form a secondfirst-electroconductive-type semiconductor region on the surface of thesecond principal face of the semiconductor substrate.

According to the above solid-state imaging device, and the solid-stateimaging device manufactured by the above manufacturing method, aphotodiode is formed on the second principal face side of thesemiconductor substrate from the first-electroconductive-typesemiconductor region and the second-electroconductive-type semiconductorregion which have high impurity concentration. Therefore, the photodiodehaving great PN junction capacity is formed on the second principal faceside. Accordingly, the saturation signal amount of the solid-stateimaging device can be increased.

Also, the present technology is also an electronic device including sucha solid-state imaging device.

According to the present technology, the potential steps of thechannel-formed region are adjusted by the potential adjustment region,whereby signal charges of the photoelectric conversion region can beread out to the channel-formed region of the semiconductor substratewithout disturbance. As a result thereof, all of the signal charges ofthe photoelectric conversion region can be read out in the solid-stateimaging device where the photoelectric conversion region is provided toa deep position of the semiconductor substrate, whereby improvement inimaging properties can be realized by preventing occurrence of anafterimage.

Also, according to the present technology, the solid-state imagingdevice whereby saturation charge amount can be improved can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view illustrating the configuration of asolid-state imaging device, and FIG. 1B is a potential profile in thedepth direction in a photodiode of the solid state imaging device;

FIG. 2A is a cross-sectional view illustrating the configuration of asolid-state imaging device, and FIG. 2B is a potential profile in thedepth direction in a photodiode of the solid state imaging device;

FIG. 3A is a cross-sectional view illustrating the configuration of asolid-state imaging device, and FIG. 3B is a potential profile in thedepth direction in a photodiode of the solid state imaging device;

FIG. 4 is a plan view illustrating the configuration of a solid-stateimaging device according to a first embodiment;

FIG. 5A is a cross-sectional view illustrating the configuration of thesolid-state imaging device according to the first embodiment, and FIG.5B is a potential profile in the depth direction in a photodiode of thesolid state imaging device according to the first embodiment;

FIGS. 6A through 6D are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIGS. 7E through 7H are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIGS. 81 through 8K are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIGS. 9L through 9N are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIGS. 10O through 10Q are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIGS. 11R through 11T are manufacturing process diagrams of thesolid-state imaging device according to the first embodiment;

FIG. 12A is a cross-sectional view illustrating the configuration of thesolid-state imaging device according to the first embodiment, and FIG.12B is a potential profile in Y-Y′ cross-section of the solid stateimaging device illustrated in FIG. 12A;

FIG. 13 is a potential profile in the Y-Y′ cross-section of the solidstate imaging device illustrated in FIG. 11T;

FIG. 14A is a cross-sectional view illustrating the configuration of amodification of the solid-state imaging device according to the firstembodiment, and FIG. 14B is a potential profile in the depth directionin a photodiode of the modification of the solid state imaging deviceaccording to the first embodiment;

FIG. 15A is a cross-sectional view illustrating the configuration of amodification of the solid-state imaging device according to the firstembodiment, and FIG. 15B is a potential profile in the depth directionin a photodiode of the modification of the solid state imaging deviceaccording to the first embodiment;

FIG. 16 is a cross-sectional view illustrating the configuration of asolid-state imaging device according to a second embodiment;

FIG. 17A is a potential profile at the time of accumulating electriccharges of the solid-state imaging device according to the secondembodiment, and FIG. 17B is a potential profile at the time oftransferring electric charges of the solid-state imaging deviceaccording to the second embodiment;

FIGS. 18A through 18C are manufacturing process diagrams of thesolid-state imaging device according to the second embodiment;

FIGS. 19D through 19F are manufacturing process diagrams of thesolid-state imaging device according to the second embodiment;

FIGS. 20G through 20I are manufacturing process diagrams of thesolid-state imaging device according to the second embodiment;

FIGS. 21J through 21L are manufacturing process diagrams of thesolid-state imaging device according to the second embodiment;

FIGS. 22M through 22O are manufacturing process diagrams of thesolid-state imaging device according to the second embodiment;

FIG. 23 is a cross-sectional view illustrating the configuration of asolid-state imaging device according to a third embodiment;

FIGS. 24A through 24C are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 25D through 25F are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 26G through 26I are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 27J through 27L are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 28M through 28O are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 29P through 29R are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIGS. 30S through 30U are manufacturing process diagrams of thesolid-state imaging device according to the third embodiment;

FIG. 31 is a cross-sectional view illustrating the configuration of asolid-state imaging device according to a fourth embodiment;

FIGS. 32A through 32C are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 33D through 33F are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 34G through 34I are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 35J through 35L are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 36M through 36O are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 37P through 37R are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIGS. 38S through 38U are manufacturing process diagrams of thesolid-state imaging device according to the fourth embodiment;

FIG. 39 is a cross-sectional view illustrating the configuration of asolid-state imaging device according to a fifth embodiment;

FIGS. 40A through 40C are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 41D through 41F are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 42G through 42I are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 43J through 43L are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 44M through 44O are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 45P through 45R are manufacturing process diagrams of thesolid-state imaging device according to the fifth embodiment;

FIGS. 46S and 46T are manufacturing process diagrams of the solid-stateimaging device according to the fifth embodiment;

FIGS. 47A and 47B are a plan view and a cross-sectional viewillustrating the configuration of a solid-state imaging device accordingto a sixth embodiment;

FIGS. 48A and 48B are diagrams for describing driving of the solid-stateimaging device according to the sixth embodiment;

FIGS. 49A through 49C are cross-sectional process views (Part 1)illustrating manufacturing procedures of the solid-state imaging deviceaccording to the sixth embodiment;

FIGS. 50A through 50C are cross-sectional process views (Part 2)illustrating manufacturing procedures of the solid-state imaging deviceaccording to the sixth embodiment;

FIG. 51 is a cross-sectional view illustrating the configuration of asolid-state imaging device serving as a comparative example of the sixthembodiment;

FIGS. 52A and 52B are diagrams for describing driving of the solid-stateimaging device serving as a comparative example of the sixth embodiment;

FIGS. 53A and 53B are a plan view and a cross-sectional viewillustrating the configuration of a solid-state imaging device accordingto a seventh embodiment;

FIGS. 54A and 54B are diagrams for describing driving of the solid-stateimaging device according to the seventh embodiment;

FIGS. 55A through 55C are cross-sectional process views (Part 1)illustrating manufacturing procedures of the solid-state imaging deviceaccording to the seventh embodiment;

FIGS. 56A and 56B are cross-sectional process views (Part 2)illustrating manufacturing procedures of the solid-state imaging deviceaccording to the seventh embodiment;

FIG. 57 is a cross-sectional view illustrating the configuration of asolid-state imaging device serving as a comparative example of theseventh embodiment;

FIGS. 58A and 58B are diagrams for describing driving of the solid-stateimaging device serving as a comparative example of the seventhembodiment;

FIGS. 59A through 59C are cross-sectional views illustrating amodification of an embodiment; and

FIG. 60 is a schematic configuration diagram of an electronic device towhich a solid-state imaging device has been applied.

DETAILED DESCRIPTION OF EMBODIMENTS

Though most preferable mode examples for implementing the presenttechnology will be described below, the present technology is notrestricted to the following examples.

Note that description will be made in the following sequence.

1. Overview of Solid-state Imaging Device 2. First Embodiment ofSolid-state Imaging Device 3. Solid-state Imaging Device ManufacturingMethod According to First Embodiment 4. Second Embodiment of Solid-stateImaging Device 5. Solid-state Imaging Device Manufacturing MethodAccording to Second Embodiment 6. Third Embodiment of Solid-stateImaging Device 7. Solid-state Imaging Device Manufacturing MethodAccording to Third Embodiment 8. Fourth Embodiment of Solid-stateImaging Device 9. Solid-state Imaging Device Manufacturing MethodAccording to Fourth Embodiment 10. Fifth Embodiment of Solid-stateImaging Device 11. Solid-state Imaging Device Manufacturing MethodAccording to Fifth Embodiment 12. Sixth Embodiment (Example ofSolid-state Imaging Device to Which Potential Adjustment Region IsProvided)

13. Seventh Embodiment (Example of Solid-state Imaging Device to WhichPinning Region Overlapped with Potential Adjustment Region Is Provided)

14. Modifications 15. Embodiment of Electronic Device

Note that, with the embodiments and modifications, common components aredenoted with the same reference numerals, and redundant description willbe omitted.

1. Overview of Solid-State Imaging Device

First, overview of a solid-state imaging device will be described.

FIGS. 1A and 1B illustrate the configuration of a solid-state imagingdevice disclosed in the above Japanese Unexamined Patent ApplicationPublication No. 2010-114274. FIG. 1A is a cross-sectional viewillustrating the configuration of the solid-state imaging device, andFIG. 1B is a potential profile in the depth direction in a photodiode(PD) of the solid-state imaging device illustrated in FIG. 1A.

A solid-state imaging device 10 illustrated in FIG. 1A includes athree-layered photodiode (PD) 14 in different depths within asemiconductor substrate 11.

The solid-state imaging device 10 includes a first photodiode (PD1)formed with a connection face between a first electroconductive type (ptype) semiconductor region 12A and a second electroconductive type (ntype) semiconductor region 13 in a deep position of the semiconductorsubstrate 11, includes a third photodiode (PD3) formed with a connectionface between a first electroconductive type (p+ type) semiconductorregion 12C of which the impurity concentration is greater than otherregions, and a second electroconductive type (n type) semiconductorregion 13 on the surface of the semiconductor substrate 11, and alsoincludes a second photodiode (PD2) formed with a connection face betweena first electroconductive type (p type) semiconductor region 12B, and asecond electroconductive type (n type) semiconductor region 13 on anintermediate layer between the first photodiode (PD1) and the thirdphotodiode (PD3).

Also, the solid-state imaging device 10 includes a vertical-typetransistor (Tr) which reads out electric charges of the PD 14. Thevertical-type Tr is configured of a readout gate electrode 16 formed viaa gate insulating film 17, a transfer channel 19 for transferring signalcharges, and a floating diffusion (FD) 18 for accumulating transferredsignal charges.

The readout gate electrode 16 is made up of a planar gate electrode 16Aformed on the semiconductor substrate 11, and a vertical-type gateelectrode 16B formed in a columnar shape in the depth direction from thesurface of the semiconductor substrate 11 under the planar gateelectrode 16A.

The FD 18 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration. The FD 18 is formed in aposition facing the PD 14 on the face of the semiconductor substrate 11via the readout gate electrode 16.

Also, an overflow path is configured of an n-type semiconductor region13 formed from the surface to the inner portion of the semiconductorsubstrate 11 along the vertical-type gate electrode 16B. That is to say,of the second electroconductive type semiconductor region 13, portionsadjacent to the first electroconductive type semiconductor region 12Athrough 12C make up the PD 1 through 3. Of the second electroconductivetype semiconductor region 13, a portion formed from the surface to theinner portion of the semiconductor substrate 11 along the vertical-typegate electrode 16B makes up an overflow path.

The transfer channel 19 is configured of a second electroconductive type(n− type) semiconductor region having low concentration, and is formedimmediately below the planar gate electrode 16A adjacent to a firstelectroconductive type semiconductor region 12C. The transfer channel 19is formed adjacent to the FD 18 and an n-type semiconductor region 13making up an overflow path.

Next, description will be made regarding potential profiles of the PD 3formed on the surface of the semiconductor substrate 11, and the PD 2formed in a deep position of the semiconductor substrate 11 shown inFIG. 1B. A potential profile illustrated in FIG. 1B illustrates thepotentials of the second electroconductive type semiconductor region 13and the first electroconductive type semiconductor regions 12A and 12Bmaking up the PD 14.

The PD 14 and FD 18 of the solid-state imaging device 10 illustrated inthe above FIG. 1 are formed by ion injection from the surface side ofthe semiconductor substrate 11. Therefore, as illustrated in FIG. 1B, inthe case of forming a photodiode in a deep position of the semiconductorsubstrate 11, a PN junction between the first electroconductive typesemiconductor region and the second electroconductive type semiconductorregion has to be created by ion injection with high energy. Therefore,the impurity of each of the first electroconductive type semiconductorregion and the second electroconductive type semiconductor regionextends into a wide range, and impurity profiles become moderate. As aresult thereof, impurity concentration around the PN junction isreduced. Therefore, the PD 1 formed in a deep position of thesemiconductor substrate 11 is small in capacity per increment area, andis small in saturation signal amount that can be accumulated.

Accordingly, with the configuration of the solid-state imaging device 10illustrated in FIGS. 1A and 1B, even when increasing the photodiodeitself in the depth direction of the semiconductor substrate 11, thesaturation signal amount of the photodiode of a substrate deep portionis small, and accordingly, saturation signal amount increase efficiencyis poor, and no great advantage is obtained in increase of saturationcharge amount.

Next, FIGS. 2A and 2B illustrate the configuration of the solid-stateimaging device disclosed in the above Japanese Unexamined PatentApplication Publication No. 2010-192483. FIG. 2A is a cross-sectionalview illustrating the configuration of the solid-state imaging device,and FIG. 2B is a potential profile in the depth direction in X-X′cross-section of a photodiode (PD) of the solid-state imaging deviceillustrated in FIG. 2A.

With a solid-state imaging device 20 illustrated in FIG. 2A, a firstphotodiode (PD 1) is formed on the opposite face side (substrate frontface) of the light incident face of a semiconductor substrate 21, and asecond photodiode (PD 2) is formed on the light incident face (substraterear face) side. A first electroconductive type (p type) semiconductorregion 25 and a first electroconductive type (p type) semiconductorregion 31 are provided between the PD 1 and PD 2 as pixel separationregions.

Also, optical components such as a color filter, a micro lens, and soforth are mounted on the incident face (substrate rear face) of thesemiconductor substrate 21. A wiring layer, a MOS transistor for readingout signal charges subjected to photoelectric conversion andaccumulated, and so forth are formed on the substrate front face side.

The PD 1 is configured of a charge accumulating region made up of asecond electroconductive type (n+ type) semiconductor region 22 havinghigh concentration, a photoelectric conversion region made up of asecond electroconductive type (n type) semiconductor region 23, and afirst electroconductive type (p+ type) semiconductor region 27 havinghigh concentration for suppressing occurrence of dark current. Also, thePD 2 is configured of a photoelectric conversion region made up of asecond electroconductive type (n− type) semiconductor region 24, and afirst electroconductive type (p+ type) semiconductor region 26 havinghigh concentration.

According to the above configuration, as illustrated in FIG. 2B, withthe PD 1 and PD 2, a sufficient potential region is formed up to a deepregion.

A smooth slope is formed from the second electroconductive typesemiconductor region 24 of the PD 2 on the rear face side to the secondelectroconductive type semiconductor region 22 of the PD 1 on the frontface side. The PD 2 on the rear face side has to transfer electriccharges to the transfer Tr formed on the front face side of thesemiconductor substrate 21, and accordingly, the potential has to belower than the PD 1 on the front face side.

Next, a forming method for the PD 1 and PD 2 of the solid-state imagingdevice illustrated in FIG. 2A will be described.

First, the PD 1, an impurity diffusion region making up thevertical-type Tr, and a p-type semiconductor region 25 serving as apixel separation region are formed by ion injection as to the face sideof the semiconductor substrate 21 using normal process flow. Further, aninsulating layer and an electroconductive layer are formed on thesemiconductor substrate 21, and a gate electrode and wirings and soforth are formed.

Next, the wiring layer side of the semiconductor substrate 21 is adheredto a supporting substrate, and the semiconductor substrate 21 is thinneddown to a thickness of around 1 to 1.5 μm using CMP (Chemical MechanicalPolishing) or etching. Next, ion injection for forming a p− typesemiconductor region 31 serving as a pixel separation region, and ioninjection for forming the PD 2 are performed from the rear face side ofthe semiconductor substrate 21. After ion injection, laser annealing isperformed on the rear face side to active the formed impurity region,and to form the PD 2.

As described above, with the solid-state imaging device illustrated inFIG. 2A, the PD 1 is formed by ion injection from the front face side ofthe semiconductor substrate 21. Next, the PD 2 is formed by ioninjection from the rear face of the semiconductor substrate 21.

According to performing ion injection from the two directions of thefront face side and rear face side of the semiconductor substrate 21, animpurity is suppressed from extending into a wide range at a deepportion of the semiconductor substrate 21, and a light receiving regioncan be extended in the depth direction of the semiconductor substrate21. Therefore, the increase ratio of saturation charge amount can beimproved. Also, the PD 2 on the rear face side can be formed withrelatively low energy.

However, with the solid-state imaging device 20 illustrated in the aboveFIGS. 2A and 2B, electric charges have to be moved to the front faceside of the semiconductor substrate 21 using the potential slope of thesemiconductor substrate 21. Therefore, the impurity concentration of thePD 2 on the rear face side is not the same or denser than the PD 1 onthe front face side. Accordingly, increase in saturation signal amountis not expected.

With the solid-state imaging device 20 having the configurationillustrated in the above FIGS. 2A and 2B, a configuration in the case ofsetting the impurity concentration of the PD 2 on the rear face side tobe the same or deeper as compared to the PD 1 on the front face side isillustrated in FIGS. 3A and 3B. FIG. 3A is a cross-sectional viewillustrating the configuration of the solid-state imaging device, andFIG. 3B is a potential profile in the depth direction in the X-X′cross-section of the photodiode (PD) of the solid-state imaging deviceillustrated in FIG. 3A.

With a solid-state imaging device 30 illustrated in FIG. 3A, a firstphotodiode (PD 1) is formed on the light incident face and the oppositeface (substrate front face) side of the semiconductor substrate 21, anda second photodiode (PD 2) is formed on the light incident face(substrate rear face). Note that the other configurations are the sameas with the solid-state imaging device 20 illustrated in the above FIG.2A.

The PD 1 is configured of a charge accumulating region made up of asecond electroconductive type (n+ type) semiconductor region 32 havinghigh concentration, a photoelectric conversion region made up of asecond electroconductive type (n type) semiconductor region 33, and afirst electroconductive type (p+ type) semiconductor region 37 havinghigh concentration for suppressing occurrence of dark current. Also, thePD 2 is configured of a photoelectric conversion region made up of asecond electroconductive type (n+ type) semiconductor region 34 of whichthe concentration is equal to or greater than the PD 1, and a firstelectroconductive type (p+ type) semiconductor region 36 having highconcentration.

According to the above configuration, as illustrated in the potentialprofile in FIG. 3B, with the PD 1 and PD 2, a sufficient potentialregion is formed up to a deep region. Also, in the case of setting theimpurity concentration of the PD 2 to be equal to or greater than thePD1, the potential of the PD 2 is increased up to the same as with thePD 1.

Upon the potential of the PD 2 being increased, the concentration of thesecond electroconductive type semiconductor region 33 formed by ioninjection from the front face side of the semiconductor substrate islow, and accordingly, a potential barrier is caused between the PD 2 andPD 1. That is to say, with the solid-state imaging device having theconfiguration illustrated in FIG. 3A, electric charges generated at thephotodiode (PD 2) on the rear face side are not transferred to the FD onthe surface. Also, the second electroconductive type semiconductorregion 33 is formed in a deeper portion of the semiconductor substratethan the second electroconductive type semiconductor region 32, andaccordingly, an impurity is readily extended as compared to the secondelectroconductive type semiconductor region 32, and it is difficult toform high concentration.

Accordingly, upon setting the impurity concentration of the PD 2 on therear face side to be equal to or denser than the PD 1 on the front faceside, a potential barrier is generated in the middle of a transfer path,which disables charge transfer from the PD 2 to the FD. As a resultthereof, with the solid-state imaging device 30 illustrated in FIG. 3A,saturation signal amount is not increased.

As described above, from the perspective of charge transfer, with theconfiguration of a solid-state imaging device according to the relatedart, the impurity concentration of the PD on the front face side wherethe transfer Tr is formed has to be set to be higher, and the impurityconcentration of the PD formed on the rear face side (light incidentface side) has to be set to be lower than the than at the front faceside. With this configuration, the impurity concentration at the PD onthe front face side can be set to be higher, and accordingly, a steep PNjunction between the first electroconductive type semiconductor regionand the second electroconductive type semiconductor region is obtained,and PN junction capacity can be increased. However, no steep junction isobtained between the first electroconductive type semiconductor regionand the second electroconductive type semiconductor region of the PD onthe rear face side, and accordingly, PN junction capacity is notincreased.

2. First Embodiment of Solid-State Imaging Device [Configuration Exampleof Solid-State Imaging Device: Schematic Configuration Diagram]

A specific embodiment of a solid-state imaging device according to thepresent embodiment will be described below.

FIG. 4 illustrates a schematic configuration diagram of a MOS (MetalOxide Semiconductor) type solid-state imaging device as an example ofthe solid-state imaging device.

A solid-state imaging device 40 illustrated in FIG. 4 is configured of asemiconductor substrate, for example, a pixel portion (so-called imagingregion) 43 where pixels 42 including photodiodes serving as multiplephotoelectric conversion units are regularly arrayed in atwo-dimensional manner on a silicon substrate, and a peripheral circuitportion. The pixels 42 include photodiodes, and multiple pixeltransistors (so-called MOS transistors).

The multiple pixel transistors can be configured of, for example, threetransistors of a transfer transistor, a reset transistor, and anamplification transistor. Additionally, the multiple pixel transistorscan also be configured of four transistors by adding a selectiontransistor thereto.

The peripheral circuit portion is configured of a vertical drivingcircuit 44, column signal processing circuits 45, a horizontal drivingcircuit 46, an output circuit 47, a control circuit 48, and so forth.

The control circuit 48 generates a clock signal or control signalserving as a reference of operations of the vertical driving circuit 44,column signal processing circuits 45, horizontal driving circuit 46, andso forth based on a vertical synchronizing signal, a horizontalsynchronizing signal, and master clock. The control circuit 48 inputsthese signals to the vertical driving circuit 44, column signalprocessing circuits 45, horizontal driving circuit 46, and so forth.

The vertical driving circuit 44 is configured of a shift register, forexample. The vertical driving circuit 44 selectively scans the pixels 42of the pixel portion 43 in increments of rows sequentially in thevertical direction, and supplies a pixel signal based on a signal chargegenerated according to light receiving amount at the photoelectricconversion element of each pixel 42 through a vertical signal line 49 tothe column signal processing circuits 45.

The column signal processing circuits 45 are arrayed for each column ofthe pixels 42, for example, and subject signals output from four rowsworth of pixels 42 to signal processing such noise removal or the likeusing a signal from a black reference pixel (formed around an effectivepixel region) for each pixel column. That is to say, the column signalprocessing circuits 45 perform signal processing such as CDS (correlateddouble sampling) for removing fixed pattern noise peculiar to the pixels42, signal amplification, or the like. A horizontal selection switch(not illustrated) is provided to the output stages of the column signalprocessing circuits 45 so as to be connected to the horizontal signalline 41.

The horizontal driving circuit 46 is configured of, for example, a shiftregister, sequentially selects each of the column signal processingcircuits 45 by sequentially outputting a horizontal scan pulse, andoutputs a pixel signal from each of the column signal processingcircuits 45 to the horizontal signal line 41.

The output circuit 47 subjects a signal sequentially supplied from eachof the column signal processing circuits 45 through the horizontalsignal line 41 to signal processing, and outputs the signal.

The driving circuits for driving the pixels are configured of the aboveperipheral circuits 44 through 48, and pixel circuits provided to thepixel portion 43. Note that the peripheral circuits 44 through 48 may bedisposed in a position laminated on the pixel portion 43.

In the case of applying the above solid-state imaging device 40 to arear-surface irradiation type solid-state imaging device, no wiringlayer is formed on the rear face on the light incident face (so-calledlight receiving face) side, and a wiring layer is formed on the frontface side on the opposite side of the light receiving face.[Configuration Example of Solid-state Imaging Device: Pixel Portion]

Next, FIGS. 5A and 5B illustrate principal portions making up one pixelof the solid-state imaging device according to the first embodiment.FIG. 5A is a cross-sectional view illustrating the configuration of thesolid-state imaging device, and FIG. 5B is a potential profile in thedepth direction in X-X′ cross-section of a photodiode (PD) of thesolid-state imaging device illustrated in FIG. 5A.

With a solid-state imaging device 50 illustrated in FIG. 5A, a firstphotodiode (PD 1) is formed on the surface on an opposite face(substrate front face) 51A side of the light incident face of asemiconductor substrate 51. A second photodiode (PD 2) is formed on thesurface on a light incident face (substrate rear face) 51B side of thesemiconductor substrate 51.

Also, a wiring layer 52 made up of an insulating layer and a wiring isprovided onto the substrate front face 51A of the semiconductorsubstrate 51. Optical components such as a photoelectric conversionfilm, a color filter, a micro lens, and so forth which are notillustrated are mounted on the substrate rear face 51B of thesemiconductor substrate 51 via an insulating layer 64.

The PD 1 includes, in order from the substrate front face 51A side, afirst electroconductive type (p+ type) semiconductor region 54 havinghigh concentration, a second electroconductive type (n+ type)semiconductor region 55 having high concentration, and a secondelectroconductive type (n type) semiconductor region 56.

The PD 2 includes, in order from the substrate rear face 51B side, afirst electroconductive type (p+ type) semiconductor region 59 havinghigh concentration, a second electroconductive type (n+ type)semiconductor region 58 having high concentration, and a secondelectroconductive type (n type) semiconductor region 57.

The n type semiconductor region 56 b of the PD 1, and the n typesemiconductor region 57 of the PD 2 are connected at the center of thesemiconductor substrate 51, and the PD 1 and PD 2 are integrally formed.

The p+ type semiconductor regions 54 and 59 are impurity regions forsuppressing occurrence of dark current at the PD1 or PD 2. The n+ typesemiconductor regions 55 and 58 are charge accumulating regions, and then type semiconductor regions 56 and 57 are photoelectric conversionregions.

With the solid-state imaging device 50, the first electroconductive typesemiconductor region of the PD 2 made up of the n+ type semiconductorregion 58 and n type semiconductor region 57 is configured so as to haveimpurity concentration that will be described in the following.

The first electroconductive type semiconductor region of the PD 2includes an impurity on a face adjacent to the p+ type semiconductorregion 59 with impurity concentration equal to or greater than a faceadjacent to a layer opposite side of the p+ type semiconductor region59. Here, with the configuration of the solid-state imaging deviceillustrated in FIG. 5A, the layer opposite side of the p+ typesemiconductor region 59 is the n type semiconductor region 56.

That is to say, the impurity concentration at a joint face between thep+ type semiconductor region 59 and the n+ type semiconductor region 58,and the impurity concentration at a joint face between the n typesemiconductor region 57 and the n type semiconductor region 56 of the PD1 are compared. At this time, the impurity concentration at a joint facebetween the p+ type semiconductor region 59 and the n+ typesemiconductor region 58 is equal to or greater than the impurityconcentration at a joint face between the n type semiconductor region 57and the n type semiconductor region 56 of the PD 1. In this way, theimpurity concentration of the first electroconductive type semiconductorregion (n+ type semiconductor region 58 and n type semiconductor region57) of the PD 2 is adjusted.

With regard to the PD 1 as well, in the same way as with the above PD 2,the impurity concentration of the first electroconductive typesemiconductor region (n+ type semiconductor region 58 and n typesemiconductor region 57) of the PD 1 is adjusted. That is to say, theimpurity concentration of the PD 1 is adjusted so that the impurityconcentration of the p+ type semiconductor region 55 of the faceadjacent to the p+ type semiconductor region 54 is equal to or greaterthan the impurity concentration of the n type semiconductor region 56 ofthe face adjacent to the n type semiconductor region 57.

Also, the solid-state imaging device 50 illustrated in FIG. 5A includesa vertical-type transistor (Tr) for reading out electric charges of thePD 1 and PD 2. The vertical-type Tr is configured of a transfer gateelectrode 53 formed via the insulating film 63, and a floating diffusion(FD) 60 for accumulating transferred signal charges.

The transfer gate electrode 53 is configured of a planar gate electrode53A formed on the semiconductor substrate 51, and a vertical-type gateelectrode 53B formed in a columnar shape in the depth direction from thesurface of the semiconductor substrate 51 below the planar gateelectrode 53A.

The FD 60 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration, and is formed on thesurface of the semiconductor substrate 51 in a position facing the PD 1and PD 2 via the transfer gate electrode 53.

Also, a first pixel separation portion 61 and a second pixel separationportion 62 are formed by a first electroconductive type (p type)semiconductor region as pixel separation regions for sectioning theincrement pixels. The first and second pixel separation portions 61 and62 are formed between adjacent pixels. The first pixel separationportion 61 is formed on the front face 51A side of the semiconductorsubstrate 51, and the second pixel separation portion 62 is formed onthe rear face 51B side of the semiconductor substrate 51. The firstpixel separation portion 61 and second pixel separation portion 62 areconnected and integrated at the center of the semiconductor substrate51. Also, the FD 60 is formed within the first pixel separation portion61.

Next, description will be made regarding a potential profile in thedepth direction in the X-X′ cross-section of the PD 1 and PD 2 of thesolid-state imaging device having the above configuration. Asillustrated in FIG. 5B, with the PD 1 and PD 2, a sufficient potentialregion is formed up to a deep region.

Also, with the solid-state imaging device 50, the impurity concentrationof the PD 2 is formed similar to the PD 1. Therefore, the potential ofthe n+ type semiconductor region 58 of the PD 2 is formed high in thesame level as with the n+ type semiconductor region 55 of the PD 1.

Also, with the PD 2, the potential of the n+ type semiconductor region58 is high, and the potential is gently lowered from the n+ typesemiconductor region 58 to the n type semiconductor region 57 side. Inthis way, the potential profile is formed in accordance with the aboveimpurity concentration of the PD2. That is to say, a connection facebetween the p+ type semiconductor region 59 and the n+ typesemiconductor region 58 on the rear face 51B side of the semiconductorsubstrate 51 has an impurity of concentration equal to or greater than aconnection face between the PD 1 and PD 2. Therefore, the potential ofthe n+ type semiconductor region 58 on the p+ type semiconductor region59 side becomes high.

With the configuration of the above solid-state imaging device 50,positive voltage is applied to the transfer gate electrode 53 at thetime of readout, whereby the potential (voltage) immediately below thetransfer gate electrode 53 is changed. Signal charges accumulated in thePD 1 and PD 2 are passed through a region around the vertical-type gateelectrode 53B of the transfer gate electrode 53 and transferred to theFD 60.

At this time, the impurity concentration of the PD 2 on the rear faceside is high, and even with a configuration wherein charge transferaccording to potential slope according to the related art is notperformed, electric charges accumulated in the n+ type semiconductorregion 58 of the PD 2 and the n type semiconductor region 57 with thegate electrode 53 are transferred to the FD 60 by the vertical-type Tr.

In this way, according to the configuration of the solid-state imagingdevice 50, the electric charges of the PD 2 formed with the sameimpurity concentration as with the PD 1 can be read out. Accordingly,the impurity concentration of the PD 2 formed on the rear face 51B canbe increased, and accordingly, a steep PN junction is obtained betweenthe p+ type semiconductor region 59 and the n+ type semiconductor region58. The PN junction capacity of the PD 2 can be increased, and thesaturation signal amount of the solid-state imaging device 50 can beincreased.

3. Solid-State Imaging Device Manufacturing Method According to FirstEmbodiment

Next, an example of a solid-state imaging device manufacturing methodaccording to the first embodiment will be described. Note that, withdescription of the following manufacturing method, the sameconfigurations as with the configurations of the solid-state imagingdevice 50 according to the first embodiment illustrated in the aboveFIGS. 5A and 5B are denoted with the same reference numerals, and thedetails of the configurations will be omitted. Also, description will beomitted regarding the manufacturing method for the semiconductorsubstrate, wiring layers, other various types of transistors, andvarious elements formed on the solid-state imaging device. These can bemanufactured by a method according to the related art.

First, as illustrated in FIG. 6A, the semiconductor substrate 51 isprepared. As for the semiconductor substrate 51, a Si substrate isemployed, for example. Insulating layers 63 and 64 for surfaceprotection made up of a thermally-oxidized film or the like are formedon the front face 51A and rear face 51B of the semiconductor substrate51.

Next, as illustrated in FIG. 6B, a resist layer 71 is formed on thefront face 51A of the semiconductor substrate 51. The resist layer 71 isformed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, the first electroconductive type (p type) impurity is ion-injectedinto the semiconductor substrate 51 from the opening of the resist layer71. According to this ion injection, the first pixel separation portion61 is formed on the front face 51A side of the semiconductor substrate51. Depth where the first pixel separation portion 61 is formed isaround half of the thickness of the semiconductor substrate 51 at thetime of finally forming the solid-state imaging device 50.

Next, as illustrated in FIG. 6C, a resist layer 72 is formed on thefront face 51A of the semiconductor substrate 51. The resist layer 72 isformed with a pattern for opening a position where the vertical-typegate electrode 53B of the transfer gate electrode 53 of the solid-stateimaging device is formed, using the photolithographic technique.

Next, as illustrated in FIG. 6D, the semiconductor substrate 51 andinsulating layer 63 are subjected to etching from the opening of theresist layer 72 using anisotropic etching. A trench 73 is formed on thesemiconductor substrate 51. Further, as illustrated in FIG. 7E, aninsulating layer 63 made up of a thermally-oxidized film or the like isformed on the semiconductor substrate 51 exposed within the trench 73.

Next, after removing the resist layer 72, as illustrated in FIG. 7F, agate electrode material layer 74 made up of polysilicon or the like isformed on the semiconductor substrate 51. With this gate electrodematerial layer 74, after the trench 73 of the semiconductor substrate 51is embedded and formed, the surface is flattened using the CMP method orthe like.

Next, as illustrated in FIG. 7G, a resist layer 75 is formed on the gateelectrode material layer 74. The resist layer 75 is formed with patternremaining on a position where the gate electrode 53 of the solid-stateimaging device is formed, and particularly a region where the planargate electrode 53A is formed, using the photolithographic technique.

Next, as illustrated in FIG. 7H, the gate electrode material layer 74 issubjected to etching with the resist layer 75 as a mask. Thus, the gateelectrode 53 is formed. With the gate electrode 53, a portion formedwithin the trench 73 of the semiconductor substrate 51 serves as avertical-type gate electrode 53B, and a portion formed on the surface ofthe semiconductor substrate 51 serves as a planar gate electrode 53A.

Next, as illustrated in FIG. 81, a resist layer 76 is formed on thesemiconductor substrate 51. The resist layer 76 is formed with a patternfor opening a position where the PD 1 of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, the second electroconductive type (n type) impurity ision-injected into a deep position of the semiconductor substrate 51 fromthe opening of the resist layer 76. Ion injection is performed up to thedepth of a half of the thickness of the semiconductor substrate 51 atthe time of finally forming the solid-state imaging device 50. Accordingto this process, a second electroconductive type (n type) semiconductorregion 56 making up the PD 1 is formed in a deep portion of thesemiconductor substrate 51.

Next, as illustrated in FIG. 8J, the second electroconductive type (ntype) impurity is ion-injected into a shallow region on the n-typesemiconductor region 56 formed in the previous process from the openingof the resist layer 76. According to this ion injection, the secondelectroconductive type (n+ type) semiconductor region 56 having highconcentration is formed.

Next, as illustrated in FIG. 8K, the first electroconductive type (ptype) impurity is ion-injected from the opening of the resist layer 76.According to this ion injection, the first electroconductive type (p+type) semiconductor region 54 having high concentration is formed on thesurface of the semiconductor substrate 51.

According to the above processes, the PD 1 is formed wherein the p+ typesemiconductor region 54, n+ type semiconductor region 55, and n typesemiconductor region 56 are laminated from the front face 51A side ofthe semiconductor substrate 51.

Next, as illustrated in FIG. 9L, a resist layer 77 is formed on thefront face 51A of the semiconductor substrate 51. The resist layer 77 isformed with a pattern for opening a position where the FD of thesolid-state imaging device is formed, and specifically, the inside ofthe first pixel separation region 61 of a position facing the PD 1 viathe gate electrode 53 is formed, using the photolithographic technique.

Next, the second electroconductive type (n type) impurity ision-injected to the semiconductor substrate 51 from the opening of theresist layer 77. According to this ion injection, the FD 60 is formedwithin the first pixel separation portion 61 on the front face 51A sideof the semiconductor substrate 51.

Next, as illustrated in FIG. 9M, a wiring layer 52 is formed on thefront face 51A of the semiconductor substrate 51. The wiring layer 52 isformed by laminating an inter-layer insulating layer and anelectroconductive layer. Also, an electroconductive layer to beconnected to the gate electrode and a PD of the solid-state imagingdevice is formed by passing through the inter-layer insulating layer.

Next, as illustrated in FIG. 9N, a supporting substrate 84 is connectedonto the wiring layer 52, and the semiconductor substrate 51 isreversed. Next, as illustrated in FIG. 10O, the rear face 51B side ofthe semiconductor substrate 51 is removed using the CMP or the like. Thesemiconductor substrate 51 is formed in predetermined thickness byremoving the rear face 51B side of the semiconductor substrate 51.

Note that, at the time of removing the rear face 51B side of thesemiconductor substrate 51, the insulating layer 64 is simultaneouslyremoved. Therefore, after forming the semiconductor substrate 51 inpredetermined thickness, the insulating layer 64 for surface protectionmade up of a thermally-oxidized film or the like is formed on the rearface 51B of the semiconductor substrate 51 again.

Next, as illustrated in FIG. 10P, a resist layer 78 is formed on therear face 51B of the semiconductor substrate 51. The resist layer 78 isformed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, the first electroconductive type (p type) impurity is ion-injectedinto the rear face 51B side of the semiconductor substrate 51 from theopening of the resist layer 78. According to this ion injection, thesecond pixel separation portion 62 is formed on the rear face 51B sideof the semiconductor substrate 51. The second pixel separation portion62 is formed from depth whereby the second pixel separation portion 62comes into contact with the already formed first pixel separationportion 61, to the rear face 51B.

According to this process, the pixel separation region made up of thefirst pixel separation portion 61 and second pixel separation portion 62is formed from the front face 51A to rear face 51B of the semiconductorsubstrate 51.

Next, as illustrated in FIG. 10Q, a resist layer 79 is formed on therear face 51B of the semiconductor substrate 51. The resist layer 79 isformed with a pattern for opening a position where the PD 2 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, the second electroconductive type (n type) impurity ision-injected into a deep position of the semiconductor substrate 51 fromthe opening of the resist layer 79. Ion injection is performed up to thedepth of a half or so of the thickness of the semiconductor substrate 51at the time of finally forming the solid-state imaging device 50. Next,the second electroconductive type (n type) semiconductor region 57making up the PD 2 is formed in a position connecting to the n typesemiconductor region 56 by diffusing the impurity up to a positionconnecting to the already formed n type semiconductor region 56 of thePD 1.

Next, as illustrated in FIG. 11R, the second electroconductive type (ntype) impurity is ion-injected into a shallow region on the n typesemiconductor region 57 formed in the previous process from the openingof the resist layer 79. According to this ion injection, the secondelectroconductive type (n+ type) semiconductor region 58 having highconcentration is formed.

Next, as illustrated in FIG. 11S, the first electroconductive type (ptype) impurity is ion-injected from the opening of the resist layer 79.According to this ion injection, the first electroconductive type (p+type) semiconductor region 59 having high concentration is formed on therear face 51B of the semiconductor substrate 51.

According to the above processes, there is formed the PD 2 having aconfiguration wherein the p+ type semiconductor region 59, n+ typesemiconductor region 58, and n type semiconductor region 57 arelaminated from the rear face 51B side of the semiconductor substrate 51.

Next, as illustrated in FIG. 11T, the semiconductor substrate 51 wherethe PD 1 and PD 2 and so forth are formed is subjected to heat treatmentaccording to laser annealing or the like from the rear face 51B side.For example, activation of an impurity formed within the semiconductorsubstrate 51 is performed by heat treatment of 1000° C.

According to the above processes, the solid-state imaging deviceaccording to the present embodiment can be manufactured.

With the above-mentioned solid-state imaging device manufacturing methodaccording to the present embodiment, the PD 1 is formed by ion injectionfrom the front face 51A side of the semiconductor substrate 51. Next,the PD 2 is formed by ion injection from the rear face 51B side of thesemiconductor substrate 51.

In this way, the PD 1 to be formed on the front face 51A side of thesemiconductor substrate 51 is formed by ion injection from the frontface 51A side, whereby an impurity region having high concentration canbe formed on the front face 51A side of the semiconductor substrate 51without decreasing the concentration of the impurity.

Further, the PD 2 to be formed on the rear face 51B side of thesemiconductor substrate 51 is formed by ion injection from the rear face51B side, whereby an impurity region having high concentration can beformed on the rear face 51B side of the semiconductor substrate 51without decreasing the concentration of the impurity.

Therefore, a steep PN junction is formed between the p+ typesemiconductor regions 54 and 59 and the n+ type semiconductor regions 55and 58. As a result thereof, the PN junction capacity between the PD 1and PD 2 can be increased, and the saturation signal amount of thesolid-state imaging device 50 can be increased.

Also, with a junction portion between the PD 1 and PD 2 of the centerportion of the semiconductor substrate 51, the n type semiconductorregions 56 and 57 are formed by ion injection up to the depth of a halfor so of the semiconductor substrate 51. Therefore, the depths of the PD1 and PD 2 can be secured without performing ion injection having highconcentration on the center portion of the semiconductor substrate 51 ascompared to the front face and rear face sides. Accordingly, theaccumulation amount of the signal charges can be increased.

Also, according to the above-mentioned manufacturing method according tothe present embodiment, with a process for injecting a p type impurityto form a pixel separation region, ion injection from the front face 51Aside of the semiconductor substrate 51, and ion injection from the rearface 51B are performed. According to each of ion injections, the firstpixel separation portion 61 and second pixel separation portion 62 areformed up to the depth of a half or so, whereby diffusion of an impurityto be generated at the time of performing ion injection up to a deepregion of the substrate can be suppressed.

For example, FIGS. 12A and 12B illustrate the schematic configuration ofthe solid-state imaging device in the case that a pixel separationregion is formed by one process by performing ion injection up to thesame depth as with the thickness of the semiconductor substrate. FIG.12A is a cross-sectional view of the solid-state imaging device. FIG.12B is a potential profile in Y-Y′ cross-section of the solid-stateimaging device illustrated in FIG. 12A.

With a pixel separation portion 61A made up of a p type impurity region,an ion injection cross-section is extended by diffusion of an impurityas the pixel separation portion 61A deepens from the surface of thesemiconductor substrate. The diffused pixel separation region is low inimpurity concentration, and accordingly, the potential slope is reducedas illustrated in FIG. 12B. The potential profile region on the lightincident face side of the semiconductor substrate is then flattened.Therefore, electric charges (electron e−) generated at the pixelseparation region readily moves to an adjacent pixel. This becomes acause for increasing color mixture of the solid-state imaging device.

On the other hand, with the solid-state imaging device manufacturingmethod according to the present embodiment, diffusion of an impurity ata deep portion of the semiconductor substrate is suppressed byperforming ion injection up to the depth of a half or so of thethickness of the semiconductor substrate from both faces of thesemiconductor substrate. Therefore, the pixel separation region can benarrowed as compared to the above case illustrated in FIG. 12A. FIG. 13illustrates a potential profile at the Y-Y′ cross-section of thesolid-state imaging device illustrated in FIG. 11T.

As illustrated in FIG. 13, the pixel separation region can be narrowed,and accordingly, a potential slope on the light incident face side ofthe semiconductor substrate is increased without deteriorating impurityconcentration. In particular, the potential profile has a shape wherethe slope faces the photodiode side. Therefore, electric charges(electrons) generated at the pixel separation region can be moved to thephotodiode side, and movement to an adjacent pixel can be suppressed.Accordingly, color mixture of the solid-state imaging device can besuppressed.

[First Modification]

Next, FIGS. 14A and 14B illustrate the configuration of a solid-stateimaging device according to a first modification of the firstembodiment. FIG. 14A is a cross-sectional view illustrating theconfiguration of the solid-state imaging device, and FIG. 14B is apotential profile in the depth direction at X-X′ cross-section of aphotodiode (PD) of the solid-state imaging device illustrated in FIG.14A.

With a solid-state imaging device 80 illustrated in FIG. 14A, a secondelectroconductive type (n++ type) semiconductor region 81 having higherconcentration than the solid-state imaging device according to the firstembodiment is formed on the PD 2 formed on the rear face 51B side of thesemiconductor substrate 51. Note that configurations other than this n++type semiconductor region 81 are the same configurations as with theabove-mentioned first embodiment, and accordingly, description thereofwill be omitted.

The PD 1 of the solid-state imaging device 80 illustrated in FIG. 14Aincludes, in order from the substrate front face 51A side, a firstelectroconductive type (p+ type) semiconductor region 54 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 55 having high concentration, and a second electroconductive type(n++ type) semiconductor region 56.

The PD 2 includes, in order from the substrate rear face 51B side, afirst electroconductive type (p+ type) semiconductor region 59 havinghigh concentration, a second electroconductive type (n++ type)semiconductor region 81 having high concentration, and a secondelectroconductive type (n type) semiconductor region 57.

The n type semiconductor region 56 of the PD 1, and the n typesemiconductor region 57 of the PD 2 are connected at the center of thesemiconductor substrate 51, and the PD 1 and PD 2 are integrally formed.

With the solid-state imaging device 80 thus configured, a photoelectricconversion region of the PD 2 is formed by the n++ type semiconductorregion 81 having high concentration. Therefore, as a potential profilebeing illustrated in FIG. 14B, the potential of the n++ typesemiconductor region 81 of the PD 2 is formed higher than the n+ typesemiconductor region 55 of the PD 1.

Accordingly, a steep PN junction is obtained between the p+ typesemiconductor region 59 and n++ type semiconductor region 81 of the rearface 51B. The impurity concentration of the n++ type semiconductorregion 81 is great, and accordingly, this PN junction capacity is alsogreater than that of the solid-state imaging device 50 according to thefirst embodiment illustrated in FIGS. 5A and 5B. Accordingly, the PNjunction capacity of the PD 2 can be increased, and the saturationsignal amount of the solid-state imaging device 80 can be increased.

Also, even when a high-potential region is formed on the rear face 51Bside, in the same way as with the first embodiment, a vertical-typetransistor is formed, and accordingly, transfer of the signal charges ofthe PD 2 on the rear face 51B side can readily be performed.

[Second Modification]

Next, FIGS. 15A and 15B illustrate the configuration of a solid-stateimaging device according to a second modification of the firstembodiment. FIG. 15A is a cross-sectional view illustrating theconfiguration of the solid-state imaging device, and FIG. 15B is apotential profile in the depth direction at X-X′ cross-section of aphotodiode (PD) of the solid-state imaging device illustrated in FIG.15A.

With a solid-state imaging device 82 illustrated in FIG. 15A, a secondelectroconductive type (n++ type) semiconductor region 83 having higherconcentration than the solid-state imaging device according to the firstembodiment is formed on the PD 1 formed on the front face 51A side ofthe semiconductor substrate 51. Note that configurations other than thisn++ type semiconductor region 83 are the same configurations as with theabove-mentioned first embodiment, and accordingly, description thereofwill be omitted.

The PD 1 of the solid-state imaging device 82 illustrated in FIG. 15Aincludes, in order from the substrate front face 51A side, a firstelectroconductive type (p+ type) semiconductor region 54 having highconcentration, a second electroconductive type (n++ type) semiconductorregion 83 having high concentration, and a second electroconductive type(n++ type) semiconductor region 56.

The PD 2 includes, in order from the substrate rear face 51B side, afirst electroconductive type (p+ type) semiconductor region 59 havinghigh concentration, a second electroconductive type (n+ type)semiconductor region 58 having high concentration, and a secondelectroconductive type (n type) semiconductor region 57.

The n type semiconductor region 56 of the PD 1, and the n typesemiconductor region 57 of the PD 2 are connected at the center of thesemiconductor substrate 51, and the PD 1 and PD 2 are integrally formed.

With the solid-state imaging device 82 thus configured, a photoelectricconversion region of the PD 1 is formed by the n++ type semiconductorregion 83 having high concentration. Therefore, as a potential profilebeing illustrated in FIG. 15B, the potential of the n++ typesemiconductor region 83 of the PD 1 is formed higher than the n+ typesemiconductor region 58 of the PD 2.

Accordingly, a steep PN junction is obtained between the p+ typesemiconductor region 54 and n++ type semiconductor region 83 of thefront face 51A. The impurity concentration of the n++ type semiconductorregion 83 is great, and accordingly, this PN junction capacity is alsogreater than that of the solid-state imaging device 50 according to thefirst embodiment illustrated in FIGS. 5A and 5B. Accordingly, the PNjunction capacity of the PD 1 can be increased, and the saturationsignal amount of the solid-state imaging device 82 can be increased.

Note that the solid-state imaging devices of the first and secondmodifications can be manufactured, with the above-mentioned solid-stateimaging device manufacturing method according to the first embodiment,by adjusting injection amount at ion injection process of the secondelectroconductive type impurity illustrated in FIG. 8J or 11R.

4. Second Embodiment of Solid-State Imaging Device

Next, the configuration of a solid-state imaging device according to asecond embodiment will be described.

FIG. 16 illustrates principal portions making up one pixel of thesolid-state imaging device according to the second embodiment. FIG. 16is a cross-sectional view illustrating the configuration of thesolid-state imaging device.

With a solid-state imaging device 90 illustrated in FIG. 16, a firstphotodiode (PD 1) is formed on the surface on an opposite face(substrate front face) 91A side of the light incident face of asemiconductor substrate 91. A second photodiode (PD 2) is formed on thesurface on a light incident face (substrate rear face) 91B side of thesemiconductor substrate 91.

Also, a wiring layer 92 made up of an insulating layer and a wiring isprovided onto the substrate front face 91A of the semiconductorsubstrate 91. Optical components such as a photoelectric conversionfilm, a color filter, a micro lens, and so forth which are notillustrated are mounted on the substrate rear face 91B of thesemiconductor substrate 91 via an insulating layer 102.

The PD 1 includes, in order from the substrate front face 91A side, afirst electroconductive type (p+ type) semiconductor region 94 havinghigh concentration, and a second electroconductive type (n+ type)semiconductor region 95 having high concentration.

The PD 2 includes, in order from the substrate rear face 91B, a firstelectroconductive type (p+ type) semiconductor region 97 having highconcentration, and a second electroconductive type (n+ type)semiconductor region 96 having high concentration.

The n+ type semiconductor region 95 of the PD 1, and the n+ typesemiconductor region 96 of the PD 2 are connected at the center of thesemiconductor substrate 91, and the PD 1 and PD 2 are integrally formed.

The p+ type semiconductor regions 94 and 97 are impurity regions forsuppressing occurrence of dark current at the PD1 or PD 2. The n+ typesemiconductor regions 95 and 96 are charge accumulating regions.

Also, the n+ type semiconductor region 95 of the PD 1, and the n+ typesemiconductor region 96 of the PD 2 are connected within thesemiconductor substrate 91. The impurity concentration of thesolid-state imaging device 90 is adjusted so that the impurityconcentration at a connection face between the n+ type semiconductorregion 95 and the n+ type semiconductor region 96 becomes equal to orgreater than the impurity concentration of the n+ type semiconductorregion 96 of a connection face with the p+ type semiconductor region 97of the PD 2. Similarly, the impurity concentration is adjusted so thatthe impurity concentration at a connection face between the n+ typesemiconductor region 95 and the n+ type semiconductor region 96 becomesequal to or greater than the impurity concentration of the n+ typesemiconductor region 95 of a connection face with the p+ typesemiconductor region 94 of the PD 1.

In this way, the n+ type semiconductor region 95 and the n+ typesemiconductor region 96 of which the impurity concentrations on thecenter sides are adjusted are connected so as to have concentrationequal to or greater than the front face 91A and rear face 91B of thesemiconductor substrate 91, whereby a configuration wherein no potentialbarrier is formed can be realized.

Also, the solid-state imaging device 90 illustrated in FIG. 16 includesa transfer transistor (Tr) for reading out electric charges of the PD 1and PD 2. The transfer Tr is configured of a transfer gate electrode 93formed via the insulating film 101, and a floating diffusion (FD) 98 foraccumulating transferred signal charges.

The FD 60 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration, and is formed on thesurface of the semiconductor substrate 91 in a position facing the PD 1and PD 2 via the transfer gate electrode 93.

Also, a first pixel separation portion 99 and a second pixel separationportion 100 for sectioning the increment pixels are formed with a firstelectroconductive type (p type) semiconductor region. The first andsecond pixel separation portions 99 and 100 are formed between adjacentpixels. The first pixel separation portion 99 is formed on the frontface 91A side of the semiconductor substrate 91, and the second pixelseparation portion 100 is formed on the rear face 91B side of thesemiconductor substrate 91. The first pixel separation portion 99 andsecond pixel separation portion 100 are connected and integrated at thecenter of the semiconductor substrate 91. Also, the FD 98 is formedwithin the first pixel separation portion 99.

The solid-state imaging device 90 according to the second embodiment hasa configuration not including an n type semiconductor region serving asa photoelectric conversion region as compared to the above-mentionedsolid-state imaging device according to the first embodiment. Also, thetransfer gate electrode 93 is configured of a planar gate electrodealone formed on the semiconductor substrate 91, and does not include avertical-type gate electrode formed in a columnar shape in the depthdirection from the surface of the semiconductor substrate 91.

FIG. 17A illustrates a potential profile in the depth direction at thetime of accumulating electric charges at X-X′ cross-section of aphotodiode (PD) of the solid-state imaging device 90 illustrated in FIG.16. Also, FIG. 17B illustrates a potential profile in the depthdirection at the time of transferring electric charges at X-X′cross-section of the photodiode (PD) of the solid-state imaging device90 illustrated in FIG. 16.

The solid-state imaging device 90 is, as illustrated in FIG. 17A, apotential profile where the junction portion between the PD 1 and PD 2of the center of the semiconductor substrate 91 is the highest.

With the PD 1, the potential of the connection face between the p+ typesemiconductor region 94 and the n+ type semiconductor region 95 is low.The potential of the n+ type semiconductor region 95 becomes higher asthe n+ type semiconductor region 95 comes closer to the center portionof the semiconductor substrate 91 from the p+ type semiconductor region94. Also, with the PD 2, the potential of the connection face betweenthe p+ type semiconductor region 97 and the n+ type semiconductor region96 is low. The potential of the n+ type semiconductor region 96 becomeshigher as the n+ type semiconductor region 96 comes closer to the centerportion of the semiconductor substrate 91 from the p+ type semiconductorregion 97.

In this way, instead of the front face 91A and rear face 91B of thesemiconductor substrate 91, the n+ type semiconductor region 95 of thePD 1, and the n+ semiconductor region 96 of the PD 2, wherein animpurity having high concentration is injected on the center side, areconnected, whereby a configuration wherein no potential barrier isformed can be realized.

Also, with the above-mentioned transfer transistor, at the time ofreading out electric charges accumulated in the PDs, positive voltage isapplied to the transfer gate electrode 93 to change the potentialimmediately below the transfer gate electrode 93. Signal chargesaccumulated in the PD 1 and PD 2 are passed through a channel regionbelow the transfer gate electrode 93 and transferred to the FD 98.

At this time, according to the voltage applied to the transfer gateelectrode 93, as illustrated in FIG. 17B, the potential of the p+ typesemiconductor region 94 of the PD 1 closer to the transfer gateelectrode 93 is raised. As a result thereof, a potential slope is formedfrom the PD 2 to the PD 1 side. Accordingly, with the solid-stateimaging device 90, the electric charges accumulated in the PD 2 on therear face 91B side of the semiconductor substrate 91 can be transferredto the FD 98 even when including no vertical-type gate electrode.

Also, in order to perform the above-mentioned charge transfer, the n+type semiconductor region 95 of the PD 1, and the n+ type semiconductorregion 96 of the PD 2 has to be connected in a suitable manner. Whenconnection between the n+ type semiconductor region 95 and the n+ typesemiconductor region 96 is poor, and there is a low-concentration regiontherebetween, a potential barrier is formed between the PD 1 and PD 2,which disturbs charge transfer.

Therefore, as described above, it is desirable to control an impuritydistribution between the n+ type semiconductor region 95 of the PD 1,and the n+ type semiconductor region 96 of the PD 2 so as to obtain thehighest impurity concentration at the connection face between the PD 1and PD 2.

In order to connect the n+ type semiconductor region 95 of the PD 1, andthe n+ type semiconductor region 96 of the PD 2 has to be connected in asuitable manner, the thickness of the semiconductor substrate 91 has tobe thinned. For example, the thickness of the semiconductor substrate 91is set to 1.0 μm through 3 μm or so, whereby the suitable configurationof the solid-state imaging device according to the present embodimentcan be realized.

Note that, with the solid-state imaging device 90 thus configured,though an arrangement has been made wherein the center portion of thesemiconductor substrate 91 is taken as the connection face of the PD 1and PD 2, and the potential of this connection portion becomes thehighest, the connection face between the PD 1 and PD 2 may not be thecenter portion of the semiconductor substrate 91, for example. Also, aposition where the potential becomes the highest may also not be thecenter portion of the semiconductor substrate 91. As long as anarrangement wherein positive voltage is applied to the transfer gateelectrode 93, and the electric charges accumulated in the PD 2 can beread out, a position where the potential becomes the highest may beshifted to the front face 91A side or rear face 91B side from the centerof the semiconductor substrate 91. Also, a position where the potentialbecomes the highest may be shifted from the connection face between thePD 1 and PD 2 to the n+ type semiconductor region 96 or n+ typesemiconductor region 95 side by changing the impurity concentrationbetween the n+ type semiconductor region 96 and the n+ typesemiconductor region 95.

5. Solid-State Imaging Device Manufacturing Method According to SecondEmbodiment

Next, an example of a solid-state imaging device manufacturing methodaccording to the second embodiment will be described. Note that, withdescription of the following manufacturing method, the sameconfigurations as with the configurations of the solid-state imagingdevice 90 according to the second embodiment illustrated in the aboveFIG. 16 are denoted with the same reference numerals, and the details ofthe configurations will be omitted. Also, description will be omittedregarding the manufacturing method for the semiconductor substrate,wiring layers, other various types of transistors, and various elementsformed on the solid-state imaging device. These can be manufactured by amethod according to the related art.

First, as illustrated in FIG. 18A, the semiconductor substrate 91 isprepared. As for the semiconductor substrate 91, a Si substrate isemployed, for example. Insulating layers 101 and 102 for surfaceprotection made up of a thermally-oxidized film or the like are formedon the front face 91A and rear face 91B of the semiconductor substrate91.

Next, as illustrated in FIG. 18B, a resist layer 104 is formed on thefront face 91A of the semiconductor substrate 91. The resist layer 104is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, the p type impurity is ion-injected into the semiconductorsubstrate 91 from the opening of the resist layer 104. According to thision injection, a first pixel separation portion 99 is formed on thefront face 91A side of the semiconductor substrate 91. Depth where thefirst pixel separation portion 99 is formed is taken as a half or so ofthe thickness of the semiconductor substrate 91 at the time of finallyforming the solid-state imaging device 90.

Next, as illustrate in FIG. 18C, a gate electrode material layer 105made up of polysilicon or the like is formed on the semiconductorsubstrate 91. Next, as illustrated in FIG. 19D, a resist layer 106 isformed on the gate electrode material layer 105. As for the resist layer106, a position where the gate electrode 93 of the solid-state imagingdevice is formed is formed with a remaining pattern, using thephotolithography technique.

Next, as illustrated in FIG. 19E, the gate electrode material layer 105is subjected to etching with the resist layer 106 as a mask. Thus, thegate electrode 93 is formed.

Next, as illustrated in FIG. 19F, a resist layer 107 is formed on thesemiconductor substrate 91. The resist layer 107 is formed with apattern for opening a position where the PD 1 of the solid-state imagingdevice is formed, using the photolithographic technique.

Next, an n type impurity is ion-injected at high density into a deepposition of the semiconductor substrate 91 from the opening of theresist layer 107. Ion injection is performed up to the depth of a halfor so of the thickness of the semiconductor substrate 91 at the time offinally forming the solid-state imaging device 90. According to thisprocess, the n+ type semiconductor region 95 making up the PD 1 isformed in a deep portion of the semiconductor substrate 91.

Next, as illustrated in FIG. 20G, a p-type impurity is ion-injected intoa shallow region on the n+ type semiconductor region 95 formed in theprevious process from the opening of the resist layer 107. According tothis ion injection, the p+ type semiconductor region 94 is formed on thesurface of the semiconductor substrate 91.

According to the above processes, the PD 1 is formed wherein the p+ typesemiconductor region 94 and n+ type semiconductor region 95 arelaminated from the front face 91A side of the semiconductor substrate91.

Next, as illustrated in FIG. 20H, a resist layer 108 is formed on thefront face 91A of the semiconductor substrate 91. The resist layer 108is formed with a pattern for opening a position where the FD 98 of thesolid-state imaging device is formed, and specifically, the inside ofthe first pixel separation portion 99 of a position facing the PD 1 viathe gate electrode 93, using the photolithographic technique.

Next, an n-type impurity is ion-injected into the semiconductorsubstrate 91 from the opening of the resist layer 108. According to thision injection, the FD 98 is formed within the first pixel separationportion 99 on the front face 91A side of the semiconductor substrate 91.

Next, as illustrated in FIG. 20I, a wiring layer 92 is formed on thefront face 91A of the semiconductor substrate 91. The wiring layer 92 isformed by laminating an inter-layer insulating layer and anelectroconductive layer. Also, an electroconductive layer to beconnected to the gate electrode 93 of the solid-state imaging device 90is formed by passing through the inter-layer insulating layer.

Next, as illustrated in FIG. 21J, a supporting substrate 109 isconnected onto the wiring layer 92, and the semiconductor substrate 91is reversed. Next, as illustrated in FIG. 21K, the rear face 91B side ofthe semiconductor substrate 91 is removed using the CMP or the like. Thesemiconductor substrate 91 is formed in predetermined thickness, e.g., 1μm through 3 μm or so, by removing the rear face 91B side of thesemiconductor substrate 91. The insulating layer 102 for surfaceprotection made up of a thermally-oxidized film or the like is formed onthe rear face 91B of the semiconductor substrate 91 again.

Next, as illustrated in FIG. 21L, a resist layer 110 is formed on therear face 91B of the semiconductor substrate 91. The resist layer 110 isformed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the rear face 91B side ofthe semiconductor substrate 91 from the opening of the resist layer 110.According to this ion injection, the second pixel separation portion 100is formed on the rear face 91B side of the semiconductor substrate 91.The second pixel separation portion 100 is formed from depth whereby thesecond pixel separation portion 100 comes into contact with the alreadyformed first pixel separation portion 99, to the rear face 91B.

According to this process, the pixel separation region made up of thefirst pixel separation portion 99 and second pixel separation portion100 is formed from the front face 91A to rear face 91B of thesemiconductor substrate 91.

Next, as illustrated in FIG. 22M, a resist layer 111 is formed on therear face 91B of the semiconductor substrate 91. The resist layer 111 isformed with a pattern for opening a position where the PD 2 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 91 from the opening of the resist layer 111. Ioninjection is performed up to the depth of a half or so of the thicknessof the semiconductor substrate 91 at the time of finally forming thesolid-state imaging device 90. Next, the n+ type semiconductor region 96making up the PD 2 is formed in a position connected to the n− typesemiconductor region 95 by diffusing the impurity up to a positionconnected to the already formed n+ type semiconductor region 95 of thePD 1.

Next, as illustrated in FIG. 22N, a p type impurity is ion-injected intoa shallow region on the n+ type semiconductor region 96 formed in theprevious process from the opening of the resist layer 111. According tothis ion injection, the p+ type semiconductor region 97 is formed on therear face 91B of the semiconductor substrate 91.

According to the above processes, the PD 2 is formed wherein the p+ typesemiconductor region 97 and n+ type semiconductor region 96 arelaminated from the rear face 91B side of the semiconductor substrate 91.

Next, as illustrated in FIG. 22O, the semiconductor substrate 91 wherethe PD 1 and PD 2 and so forth are formed is subjected to heat treatmentaccording to laser annealing or the like from the rear face 91B side.For example, activation of an impurity formed within the semiconductorsubstrate 91 is performed by heat treatment of 1000° C.

According to the above processes, the solid-state imaging deviceaccording to the second embodiment can be manufactured.

With the above-mentioned solid-state imaging device manufacturing methodaccording to the present embodiment, the PD 1 is formed by ion injectionfrom the front face 91A side of the semiconductor substrate 91. Next,the PD 2 is formed by ion injection from the rear face 91B side of thesemiconductor substrate 91. Thus, deterioration in concentration due todiffusion of an impurity at the time of enclosing ions into a deepportion of the semiconductor substrate 91 can be prevented. Accordingly,a steep PN junction can be formed between the p+ type semiconductorregions 94 and 97 and the n+ semiconductor regions 95 and 96, and thesaturation signal amount of the PD of the solid-state imaging device 90can be increased.

Also, the semiconductor substrate 91 is set to 1 through 3 μm inthickness, whereby there can be prevented occurrence of an impurityregion having low concentration at the center of the semiconductorsubstrate 91 due to deterioration in concentration due to diffusion ofan impurity. Therefore, an arrangement may be made wherein the n+ typesemiconductor region 95 having high concentration of the PD 1, and then+ type semiconductor region 96 having high concentration of the PD 2,are directly connected.

In this way, the n+ type semiconductor regions 95 and 96 having highconcentration are connected, whereby a profile can be realized whereinno potential barrier occurs between the PD 1 and PD 2. According to suchan arrangement, readout of accumulated charges of the PD 2 by thetransfer gate electrode 93 can readily be performed, and accordingly, agate electrode to be embedded in the depth direction of thesemiconductor substrate 91 does not have to be formed. Accordingly, thesolid-state imaging device manufacturing processes can be reduced in thenumber of processes, and can be simplified.

6. Third Embodiment of Solid-State Imaging Device

Next, the configuration of a solid-state imaging device according to athird embodiment will be described.

FIG. 23 illustrates principal portions making up one pixel of thesolid-state imaging device according to the third embodiment. FIG. 23 isa cross-sectional view illustrating the configuration of the solid-stateimaging device.

With a solid-state imaging device 120 illustrated in FIG. 23, a firstphotodiode (PD 1) is provided on the surface on an opposite face(substrate front face) 121A side of the light incident face of asemiconductor substrate 121. A second photodiode (PD 2) is formed on thesurface on a light incident face (substrate rear face) 121B side of thesemiconductor substrate 121. Furthermore, a first electroconductive type(p type) semiconductor region 127 is provided between the PD 1 and PD 2.

Also, with the solid-state imaging device 120, a wiring layer 122 madeup of an insulating layer and a wiring is provided onto the substratefront face 121A of the semiconductor substrate 121. Optical componentssuch as a photoelectric conversion film, a color filter, a micro lens,and so forth which are not illustrated are mounted on the substrate rearface 121B of the semiconductor substrate 121 via an insulating layer135.

The PD 1 includes, in order from the substrate front face 121A, a firstelectroconductive type (p+ type) semiconductor region 124 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 125 having high concentration, and a second electroconductivetype (n type) semiconductor region 126.

The PD 2 includes, in order from the substrate rear face 121B, a firstelectroconductive type (p+ type) semiconductor region 130 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 129 having high concentration, and a second electroconductivetype (n type) semiconductor region 128.

The n type semiconductor region 126 of the PD 1, and the n typesemiconductor region 128 of the PD 2 are connected to the firstelectroconductive type (p type) semiconductor region 127 providedbetween the PD 1 and PD 2, and the PD 1 and PD 2 are integrally formed.

The p+ type semiconductor regions 124 and 130 are impurity regions forsuppressing occurrence of dark current at the PD1 or PD 2. The n+ typesemiconductor regions 125 and 129 are charge accumulating regions, andthe n type semiconductor regions 126 and 128 are photoelectricconversion regions.

Also, the solid-state imaging device 120 illustrated in FIG. 23 includesa vertical-type transistor (Tr) for reading out electric charges of thePD 1 and PD 2. The vertical-type Tr is configured of a transfer gateelectrode 123 formed via the insulating film 134, and a floatingdiffusion (FD) 131 for accumulating transferred signal charges.

The transfer gate electrode 123 is configured of a planar gate electrode123A formed on the semiconductor substrate 121, and a vertical-type gateelectrode 123B formed in a columnar shape in the depth direction fromthe surface of the semiconductor substrate 121 below the planar gateelectrode 123A.

The FD 131 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration, and is formed on thesurface of the semiconductor substrate 121 in a position facing the PD 1and PD 2 via the transfer gate electrode 123.

Also, a first pixel separation portion 132 and a second pixel separationportion 133 for sectioning the increment pixels are formed with a firstelectroconductive (p type) semiconductor region. The first and secondpixel separation portions 132 and 133 are formed between adjacentpixels. The first pixel separation portion 132 is formed on the frontface 121A side of the semiconductor substrate 121, and the second pixelseparation portion 133 is formed on the rear face 121B side of thesemiconductor substrate 121. The first pixel separation portion 132 andsecond pixel separation portion 133 are connected and integrated at thecenter of the semiconductor substrate 121. Also, the FD 131 is formedwithin the first pixel separation portion 132.

The solid-state imaging device 120 according to the third embodiment hasa configuration including a p type semiconductor region 127 servingbetween the PD 1 and PD 2 as compared to the above-mentioned solid-stateimaging device according to the first embodiment. Therefore, with the PD1, a PN junction between the n type semiconductor region 126 and p typesemiconductor region 127 is formed. Also, with the PD 2, a PN junctionbetween the n type semiconductor region 128 and p type semiconductorregion 127 is formed.

In the same way as with the above-mentioned solid-state imaging deviceaccording to the first embodiment, according to an arrangement whereinthe impurity concentration of the PD 2 to be formed on the rear face121B is raised, a steep PN junction is obtained between the p+ typesemiconductor region 130 and n+ type semiconductor region 129. The PNjunction capacity of the PD 2 can be increased, and the saturationsignal amount of the solid-state imaging device 120 can be increased.

Further, a PN junction is formed between the p type semiconductor region127, and the n type semiconductor regions 126 and 128. Therefore, withthe PD 1 and PD 2, the PN junction capacity can be increased as comparedto the first embodiment.

Accordingly, the saturation signal amount of the solid-state imagingdevice 120 can be increased.

7. Solid-State Imaging Device Manufacturing Method According to ThirdEmbodiment

Next, an example of a solid-state imaging device manufacturing methodaccording to the third embodiment will be described. Note that, withdescription of the following manufacturing method, the sameconfigurations as with the configurations of the solid-state imagingdevice 120 according to the third embodiment illustrated in the aboveFIG. 23 are denoted with the same reference numerals, and the details ofthe configurations will be omitted. Also, description will be omittedregarding the manufacturing method for the semiconductor substrate,wiring layers, other various types of transistors, and various elementsformed on the solid-state imaging device. These can be manufactured by amethod according to the related art.

First, as illustrated in FIG. 24A, the semiconductor substrate 121 isprepared. As for the semiconductor substrate 121, a Si substrate isemployed, for example. Insulating layers 134 and 135 for surfaceprotection made up of a thermally-oxidized film or the like are formedon the front face 121A and rear face 121B of the semiconductor substrate121.

Next, as illustrated in FIG. 24B, a resist layer 136 is formed on thefront face 121A of the semiconductor substrate 121. The resist layer 136is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, the first electroconductive type (p type) impurity is ion-injectedinto the semiconductor substrate 121 from the opening of the resistlayer 136. According to this ion injection, the first pixel separationportion 132 is formed on the front face 121A side of the semiconductorsubstrate 121. Depth where the first pixel separation portion 132 isformed is taken as a half or so of the thickness of the semiconductorsubstrate 121 at the time of finally forming the solid-state imagingdevice 120.

Next, as illustrated in FIG. 24C, a resist layer 137 is formed on thefront face 121A of the semiconductor substrate 121. The resist layer 137is formed with a pattern for opening a position where the vertical-typegate electrode 123B of the transfer gate electrode 123 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, as illustrated in FIG. 25D, the semiconductor substrate 121 andinsulating layer 134 are subjected to etching from the opening of theresist layer 137 using anisotropic etching. A trench 138 is formed onthe semiconductor substrate 121. Further, as illustrated in FIG. 25E, aninsulating layer 134 made up of a thermally-oxidized film or the like isformed on the semiconductor substrate 121 exposed within the trench 138.

Next, after removing the resist layer 137, as illustrated in FIG. 25F, agate electrode material layer 139 made up of polysilicon or the like isformed on the semiconductor substrate 121. With this gate electrodematerial layer 139, after the trench 138 of the semiconductor substrate121 is embedded and formed, the surface is flattened using the CMPmethod or the like.

Next, as illustrated in FIG. 26G, a resist layer 140 is formed on thegate electrode material layer 139. The resist layer 140 is formed with apattern remaining on a position where the gate electrode 123 of thesolid-state imaging device is formed, and particularly on a region wherethe planar gate electrode 123A is formed, using the photolithographictechnique.

Next, as illustrated in FIG. 26H, the gate electrode material layer 139is subjected to etching with the resist layer 140 as a mask. Thus, thegate electrode 123 is formed. With the gate electrode 123, a portionformed within the trench 138 of the semiconductor substrate 121 becomesa vertical-type gate electrode 123B, and a portion formed on the surfaceof the semiconductor substrate 121 becomes a planar gate electrode 123A.

Next, as illustrated in FIG. 26I, a resist layer 141 is formed on thesemiconductor substrate 121. The resist layer 141 is formed with apattern for opening a position where the PD 1 of the solid-state imagingdevice is formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into a deep position of thesemiconductor substrate 121 from the opening of the resist layer 141.Ion injection is performed on a position where a half of the thicknessof the semiconductor substrate 121 is taken as the center at the time offinally forming the solid-state imaging device 120. According to thisprocess, a p type semiconductor region 127 is formed in a deep portionof the semiconductor substrate 121.

Next, as illustrated in FIG. 27J, an n type impurity is ion-injectedonto the p type semiconductor region 127 formed in the previous processfrom the opening of the resist layer 141. According to this process,then type semiconductor region 126 making up the PD 1 is formed in adeep portion of the semiconductor substrate 121.

Next, as illustrated in FIG. 27K, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 126 formed inthe previous process from the opening of the resist layer 141. Accordingto this ion injection, the n+ type semiconductor region 125 is formed.

Next, as illustrated in FIG. 27L, a p type impurity is ion-injected fromthe opening of the resist layer 141. According to this ion injection,the p+ type semiconductor region 124 is formed on the surface of thesemiconductor substrate 121.

According to the above processes, the PD 1 having a configurationwherein the p+ type semiconductor region 124, n+ type semiconductorregion 125, and n type semiconductor region 126 are laminated from thefront face 121A side of the semiconductor substrate 121, and the p typesemiconductor region 127 are formed.

Next, as illustrated in FIG. 28M, a resist layer 145 is formed on thefront face 121A of the semiconductor substrate 121. The resist layer 145is formed with a pattern for opening a position where the FD 131 isformed, and specifically, the inside of the first pixel separationportion 132 of a position facing the PD 1 of the solid-state imagingdevice via the gate electrode 123, using the photolithographictechnique.

Next, a second electroconductive type (n type) impurity is ion-injectedinto the semiconductor substrate 121 from the opening of the resistlayer 145. According to this ion injection, the FD 131 is formed withinthe first pixel separation portion 132 on the front face 121A side ofthe semiconductor substrate 121.

Next, as illustrated in FIG. 28N, a wiring layer 122 is formed on thefront face 121A of the semiconductor substrate 121. The wiring layer 122is formed by laminating an inter-layer insulating layer and anelectroconductive layer. Also, an electroconductive layer to beconnected to the gate electrode or PD or the like of the solid-stateimaging device is formed by passing through the inter-layer insulatinglayer.

Next, as illustrated in FIG. 28O, a supporting substrate 142 isconnected onto the wiring layer 122, and the semiconductor substrate 121is reversed. Next, as illustrated in FIG. 29P, the rear face 121B sideof the semiconductor substrate 121 is removed using the CMP or the like.The semiconductor substrate 121 is formed in predetermined thickness byremoving the rear face 121B side of the semiconductor substrate 121. Theinsulating layer 135 for surface protection made up of athermally-oxidized film or the like is formed on the rear face 121B ofthe semiconductor substrate 121 again.

Next, as illustrated in FIG. 29Q, a resist layer 143 is formed on therear face 121B of the semiconductor substrate 121. The resist layer 143is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the rear face 121B side ofthe semiconductor substrate 121 from the opening of the resist layer143. According to this ion injection, the second pixel separationportion 133 is formed on the rear face 121B side of the semiconductorsubstrate 121. The second pixel separation portion 133 is formed fromdepth whereby the second pixel separation portion 133 comes into contactwith the already formed first pixel separation portion 132, to the rearface 15B.

According to this process, the pixel separation region made up of thefirst pixel separation portion 132 and second pixel separation portion133 is formed from the front face 121A to rear face 121B of thesemiconductor substrate 121.

Next, as illustrated in FIG. 29R, a resist layer 144 is formed on therear face 121B of the semiconductor substrate 121. The resist layer 144is formed with a pattern for opening a position where the PD 2 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 121 from the opening of the resist layer 144.Ion injection is performed up to the depth of a half or so of thethickness of the semiconductor substrate 121 at the time of finallyforming the solid-state imaging device 120. Next, the n typesemiconductor region 128 making up the PD 2 is formed in a positionconnecting to the p type semiconductor region 127 by diffusing theimpurity up to a position connecting to the already formed p typesemiconductor region 127.

Next, as illustrated in FIG. 30S, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 128 formed inthe previous process from the opening of the resist layer 144. Accordingto this ion injection, the n+ type semiconductor region 129 is formed.

Next, as illustrated in FIG. 30T, a p type impurity is ion-injected fromthe opening of the resist layer 144. According to this ion injection,the p+ type semiconductor region 130 having high concentration is formedon the rear face 121B of the semiconductor substrate 121.

According to the above processes, the PD 2 is formed wherein the p+ typesemiconductor region 130, n+ type semiconductor region 129, and n+ typesemiconductor region 128 are laminated from the rear face 121B side ofthe semiconductor substrate 121.

Next, as illustrated in FIG. 30U, the semiconductor substrate 121 wherethe PD 1 and PD 2 and so forth are formed is subjected to heat treatmentaccording to laser annealing or the like from the rear face 121B side.For example, activation of an impurity formed within the semiconductorsubstrate 121 is performed by heat treatment of 1000° C.

According to the above processes, the solid-state imaging deviceaccording to the third embodiment can be manufactured.

With the above-mentioned solid-state imaging device manufacturing methodaccording to the present embodiment, the PD 1 and PD 2 are formed by ioninjection from the front face 121A side and rear face 121B side of thesemiconductor substrate 121. Also, the p type semiconductor region 127is formed between the PD 1 and PD 2 by ion injection, thereby connectingthe n type semiconductor region 126 and n type semiconductor region 128.

Diffusion for ion injection can be controlled in the event of depthbetween the PD 1 and PD 2 enough for forming the p type semiconductorregion 127. Therefore, deterioration in the concentration of the p typesemiconductor region 127 due to diffusion of an impurity does notmatter. Therefore, with a portion connected to the PD 1 and PD 2,increase in capacity due to a PN junction between the p typesemiconductor region 127 and then type semiconductor regions 126 and 128is enabled. Accordingly, there can be manufactured the solid-stateimaging device 50 of which the saturation signal amount is increased ascompared to the sold-state imaging device according to the firstembodiment.

8. Fourth Embodiment of Solid-State Imaging Device

Next, the configuration of a solid-state imaging device according to afourth embodiment will be described.

FIG. 31 illustrates principal portions making up one pixel of thesolid-state imaging device according to the fourth embodiment. FIG. 31is a cross-sectional view illustrating the configuration of thesolid-state imaging device.

With a solid-state imaging device 150 illustrated in FIG. 31, a firstphotodiode (PD 1) is provided on the surface on an opposite face(substrate front face) 151A side of the light incident face of asemiconductor substrate 151. A second photodiode (PD 2) is formed on thesurface on a light incident face (substrate rear face) 151B side of thesemiconductor substrate 151.

Also, a wiring layer 152 made up of an insulating layer and a wiring isprovided onto the substrate front face 151A of the semiconductorsubstrate 151. Optical components such as a photoelectric conversionfilm, a color filter, a micro lens, and so forth which are notillustrated are mounted on the substrate rear face 151B of thesemiconductor substrate 151 via an insulating layer 165.

The PD 1 includes, in order from the substrate front face 151A side, afirst electroconductive type (p+ type) semiconductor region 154 havinghigh concentration, a second electroconductive type (n+ type)semiconductor region 155 having high concentration, and a secondelectroconductive type (n type) semiconductor region 156.

The PD 2 includes, in order from the substrate rear face 151B, a firstelectroconductive type (p+ type) semiconductor region 159 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 158 having high concentration, and a second electroconductivetype (n type) semiconductor region 157.

The n type semiconductor region 156 of the PD 1, and the n typesemiconductor region 157 of the PD 2 are connected at the center of thesemiconductor substrate 151, and the PD 1 and PD 2 are integrallyformed.

The p+ type semiconductor regions 154 and 159 are impurity regions forsuppressing occurrence of dark current at the PD1 or PD 2. The n+ typesemiconductor regions 155 and 158 are charge accumulating regions, andthe n type semiconductor regions 156 and 157 are photoelectricconversion regions.

Also, the solid-state imaging device 150 illustrated in FIG. 31 includesa vertical-type transistor (Tr) for reading out electric charges of thePD 1 and PD 2. The vertical-type Tr is configured of a transfer gateelectrode 153 formed via the insulating layer 164, and a floatingdiffusion (FD) 161 for accumulating transferred signal charges.

The transfer gate electrode 153 is configured of a planar gate electrode153A formed on the semiconductor substrate 121, and a vertical-type gateelectrode 153B formed in a columnar shape in the depth direction fromthe face of the semiconductor substrate 121 below the planar gateelectrode 153A.

The FD 161 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration, and is formed on thesurface of the semiconductor substrate 151 in a position facing the PD 1and PD 2 via the transfer gate electrode 153.

Also, a first pixel separation portion 162 and a second pixel separationportion 163 for sectioning the increment pixels are formed with a firstelectroconductive type (p type) semiconductor region. The first andsecond pixel separation portions 162 and 163 are formed between adjacentpixels. The first pixel separation portion 162 is formed on the frontface 151A side of the semiconductor substrate 151, and the second pixelseparation portion 163 is formed on the rear face 151B side of thesemiconductor substrate 151. The first pixel separation portion 162 andsecond pixel separation portion 163 are connected and integrated at thecenter of the semiconductor substrate 151. Also, the FD 161 is formedwithin the first pixel separation portion 162.

A second electroconductive type (n type) semiconductor region 160 isprovided around the vertical-type gate electrode 153B below the planargate electrode 153A. The n type semiconductor region 160 surrounds thevertical-type gate electrode 153B, and formed from the surface of thesemiconductor substrate 151 to depth in proximity to the n+ typesemiconductor region 158 of the PD 2. The n type semiconductor region160 is a region serving as an overflow path for excess charges from thePD 1 and PD 2 to the FD 161, or a channel at the time of chargetransfer.

With the configuration of the above solid-state imaging device 150,positive voltage is applied to the transfer gate electrode 153 at thetime of readout, the potential (voltage) below the planar gate electrode153A and circumference of the vertical-type gate electrode 153B ischanged. Then type semiconductor region 160 is provided to the regionwhere the potential is changed, thereby transferring signal chargesaccumulated in the PD 1 and PD 2 to the FD 161 passing through then typesemiconductor region 160.

With the configuration of the solid-state imaging device 150, the n typesemiconductor regions 156 and 157 are formed for smoothing the potentialslope. Thus, the accumulated charges of the PD 2 can readily betransferred to the FD. Further, the solid-state imaging device 150includes the n type semiconductor region 160, and accordingly, the ntype semiconductor region 160 is in proximity to the n+ typesemiconductor region 158 of the PD 2, whereby charge transfer from thePD 1 and PD 2 to the FD 161 can readily be performed. Therefore, forexample, even when the n type semiconductor regions 156 and 157 are notincluded, or even when the impurity concentrations of the n typesemiconductor regions 156 and 157 are low, the accumulated charges ofthe PD 2 are transferred to the FD 161 passing through the n typesemiconductor region 160, and accordingly, the accumulated charges ofthe PD 2 can be read out.

Also, an arrangement may be made in the same way as with the above thirdembodiment wherein a p type semiconductor region is formed between thePD 1 and PD 2. For example, in the case of a configuration wherein a ptype semiconductor region is provided between the n type semiconductorregions 156 and 157, the saturation signal amount can be increased.Further, the n type semiconductor region 160 is provided around thevertical-type gate electrode 153B, and accordingly, when voltage isapplied to the transfer gate electrode 153 at the time of readout, thepotential of the n type semiconductor region 160 is changed. Accordingto this change of the potential of the n type semiconductor region 160,transfer of electric charges from the PD 2 to the FD 161 can readily beperformed.

9. Solid-State Imaging Device Manufacturing Method According to FourthEmbodiment

Next, an example of a solid-state imaging device manufacturing methodaccording to the fourth embodiment will be described. Note that, withdescription of the following manufacturing method, the sameconfigurations as with the configurations of the solid-state imagingdevice 150 according to the fourth embodiment illustrated in the aboveFIG. 31 are denoted with the same reference numerals, and the details ofthe configurations will be omitted. Also, description will be omittedregarding the manufacturing method for the semiconductor substrate,wiring layers, other various types of transistors, and various elementsformed on the solid-state imaging device. These can be manufactured by amethod according to the related art.

First, as illustrated in FIG. 32A, the semiconductor substrate 151 isprepared. As for the semiconductor substrate 151, a Si substrate isemployed, for example. Insulating layers 164 and 165 for surfaceprotection made up of a thermally-oxidized film or the like are formedon the front face 151A and rear face 151B of the semiconductor substrate151.

Next, as illustrated in FIG. 32B, a resist layer 166 is formed on thefront face 151A of the semiconductor substrate 151. The resist layer 166is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the semiconductor substrate151 from the opening of the resist layer 166. According to this ioninjection, the first pixel separation portion 162 is formed on the frontface 151A side of the semiconductor substrate 151. Depth where the firstpixel separation portion 162 is formed is taken as a half or so of thethickness of the semiconductor substrate 151 at the time of finallyforming the solid-state imaging device 150.

Next, as illustrated in FIG. 32C, a resist layer 167 is formed on thefront face 151A of the semiconductor substrate 151. The resist layer 167is formed with a pattern for opening a position where the vertical-typegate electrode 153B of the transfer gate electrode 153 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, as illustrated in FIG. 33D, the semiconductor substrate 151 andinsulating layer 164 are subjected to etching from the opening of theresist layer 167 using anisotropic etching. A trench 168 is formed onthe semiconductor substrate 151. Further, as illustrated in FIG. 33E, aninsulating layer 164 made up of a thermally-oxidized film or the like isformed on the semiconductor substrate 151 exposed within the trench 168.

Next, as illustrated in FIG. 33F, an n type impurity is ion-injectedinto the side wall of the trench 168 from an oblique direction asillustrated with an arrow in the drawing. According to this ioninjection, the n type semiconductor region 160 is formed on thesemiconductor substrate 151 of the side wall of the trench 168. The ntype semiconductor region 160 is formed on a region between the trench168, and the PD 1 to be formed and the first pixel separation portion162.

Next, after removing the resist layer 167, as illustrated in FIG. 34G, agate electrode material layer 169 made up of polysilicon or the like isformed on the semiconductor substrate 151. With this gate electrodematerial layer 169, after the trench 168 of the semiconductor substrate151 is embedded and formed, the surface is flattened using the CMPmethod or the like.

Next, as illustrated in FIG. 34H, a resist layer 170 is formed on thegate electrode material layer 169. The resist layer 170 is formed with apattern remaining on a position where the gate electrode 153 of thesolid-state imaging device is formed, and particularly on a region wherethe planar gate electrode 153A is formed, using the photolithographictechnique.

Next, as illustrated in FIG. 34I—, the gate electrode material layer 169is subjected to etching with the resist layer 170 as a mask. Thus, thegate electrode 153 is formed. With the gate electrode 153, a portionformed within the trench 168 of the semiconductor substrate 151 servesas a vertical-type gate electrode 153B, and a portion formed on thesurface of the semiconductor substrate 151 serves as a planar gateelectrode 153A.

Next, as illustrated in FIG. 35J, a resist layer 171 is formed on thesemiconductor substrate 151. The resist layer 171 is formed with apattern for opening a position where the PD 1 of the solid-state imagingdevice is formed, using the photolithographic technique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 151 from the opening of the resist layer 171.Ion injection is performed on a position where a half of the thicknessof the semiconductor substrate 151 at the time of finally forming thesolid-state imaging device 150 serves as the center. According to thisprocess, the n type semiconductor region 156 is formed in a deep portionof the semiconductor substrate 151.

Next, as illustrated in FIG. 35K, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 156 formed inthe previous process from the opening of the resist layer 171. Accordingto this ion injection, the n+ type semiconductor region 155 is formed.

Next, as illustrated in FIG. 35L, a p type impurity is ion-injected fromthe opening of the resist layer 171. According to this ion injection,the p+ type semiconductor region 154 is formed on the surface of thesemiconductor substrate 151.

According to the above processes, the PD 1 is formed wherein the p+ typesemiconductor region 154, n+ type semiconductor region 155, and n typesemiconductor region 156 are laminated from the front face 151A side ofthe semiconductor substrate 151.

Next, as illustrated in FIG. 36M, a resist layer 172 is formed on thefront face 151A of the semiconductor substrate 151. The resist layer 172is formed with a pattern for opening a position where the FD 161 of thesolid-state imaging device is formed, and specifically, the inside ofthe first pixel separation portion 162 of a position facing the PD 1 viathe gate electrode 153, using the photolithographic technique.

Next, an n-type impurity is ion-injected into the semiconductorsubstrate 151 from the opening of the resist layer 172. According tothis ion injection, the FD 161 is formed within the first pixelseparation portion 162 on the front face 151A side of the semiconductorsubstrate 151.

Next, as illustrated in FIG. 36N, a wiring layer 152 is formed on thefront face 151A of the semiconductor substrate 151. The wiring layer 152is formed by laminating an inter-layer insulating layer and anelectroconductive layer. Also, an electroconductive layer to beconnected to the gate electrode or PD or the like of the solid-stateimaging device is formed by passing through the inter-layer insulatinglayer.

Next, as illustrated in FIG. 36O, a supporting substrate 173 isconnected onto the wiring layer 152, and the semiconductor substrate 151is reversed. Next, as illustrated in FIG. 37P, the rear face 151B sideof the semiconductor substrate 151 is removed using the CMP or the like.The semiconductor substrate 151 is formed in predetermined thickness byremoving the rear face 151B side of the semiconductor substrate 151. Theinsulating layer 165 for surface protection made up of athermally-oxidized film or the like is formed on the rear face 151B ofthe semiconductor substrate 151 again.

Next, as illustrated in FIG. 37Q, a resist layer 174 is formed on therear face 151B of the semiconductor substrate 151. The resist layer 174is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the rear face 151B side ofthe semiconductor substrate 151 from the opening of the resist layer174. According to this ion injection, the second pixel separationportion 163 is formed on the rear face 151B side of the semiconductorsubstrate 151. The second pixel separation portion 163 is formed fromdepth whereby the second pixel separation portion 162 comes into contactwith the already formed first pixel separation portion 162, to the rearface 151B.

According to this process, the pixel separation region made up of thefirst pixel separation portion 162 and second pixel separation portion163 is formed from the front face 151A to rear face 151B of thesemiconductor substrate 151.

Next, as illustrated in FIG. 37R, a resist layer 175 is formed on therear face 151B of the semiconductor substrate 151. The resist layer 175is formed with a pattern for opening a position where the PD 2 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 151 from the opening of the resist layer 175.Ion injection is performed up to the depth of a half or so of thethickness of the semiconductor substrate 151 at the time of finallyforming the solid-state imaging device 150. Next, the n typesemiconductor region 157 making up the PD 2 is formed in a positionconnecting to the n type semiconductor region 156 by diffusing theimpurity up to a position connecting to the already formed n typesemiconductor region 156.

Next, as illustrated in FIG. 38S, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 157 formed inthe previous process from the opening of the resist layer 175. Accordingto this ion injection, the n+ type semiconductor region 158 is formed.

Next, as illustrated in FIG. 38T, a p type impurity is ion-injected fromthe opening of the resist layer 175. According to this ion injection,the p+ type semiconductor region 159 is formed on the rear face 151B ofthe semiconductor substrate 151.

According to the above processes, the PD 2 is formed wherein the p+ typesemiconductor region 159, n+ type semiconductor region 158, and n typesemiconductor region 157 are laminated from the rear face 151B side ofthe semiconductor substrate 151.

Next, as illustrated in FIG. 38U, the semiconductor substrate 151 wherethe PD 1 and PD 2 and so forth are formed is subjected to heat treatmentaccording to laser annealing or the like from the rear face 151B side.For example, activation of an impurity formed within the semiconductorsubstrate 151 is performed by heat treatment of 1000° C.

According to the above processes, the solid-state imaging deviceaccording to the fourth embodiment can be manufactured.

With the above-mentioned solid-state imaging device manufacturing methodaccording to the present embodiment, the PD 1 and PD 2 are formed by ioninjection from the front face 151A side and rear face 151B side of thesemiconductor substrate 151. Also, the n type semiconductor region 160is formed on the circumference of the vertical-type gate electrode 153Bby ion injection for connecting the PD 1 and PD 2. According to thissolid-state imaging device manufacturing method, the solid-state imagingdevice 150 can be manufactured whereby transfer of the accumulatedcharges of the PD 2 to the FD 161 can readily be performed, incomparison with the solid-state imaging device according to the firstembodiment.

10. Fifth Embodiment of Solid-State Imaging Device

Next, FIG. 39 illustrates principal portions making up one pixel of asolid-state imaging device according to a fifth embodiment.

With a solid-state imaging device 180 illustrated in FIG. 39, a wiringlayer 182 made up of an insulating layer and a wiring is provided onto asubstrate front face 181A of a semiconductor substrate 181. Opticalcomponents such as a photoelectric conversion film, a color filter, amicro lens, and so forth which are not illustrated are mounted on asubstrate rear face 181B of the semiconductor substrate 181 via aninsulating layer 196.

Also, with the solid-state imaging device 180, a first photodiode (PD 1)is provided onto the surface on the opposite face (substrate front face)181A side from the light incident face of the semiconductor substrate181. A second photodiode (PD 2) is formed on the surface on lightincident face (substrate rear face) 181B side of the semiconductorsubstrate 181.

The PD 1 includes, in order from the substrate front face 181A, a firstelectroconductive type (p+ type) semiconductor region 185 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 186 having high concentration, and a second electroconductivetype (n type) semiconductor region 187.

The PD 2 includes, in order from the substrate rear face 181B, a firstelectroconductive type (p+ type) semiconductor region 190 having highconcentration, a second electroconductive type (n+ type) semiconductorregion 189 having high concentration, and a second electroconductivetype (n type) semiconductor region 188.

The n type semiconductor region 187 of the PD 1, and the n typesemiconductor region 188 of the PD 2 are connected at the center of thesemiconductor substrate 181. Accordingly, the PD 1 and PD 2 areintegrally formed.

The p+ type semiconductor regions 185 and 190 are impurity regions forsuppressing occurrence of dark current at the PD1 or PD 2. The n+ typesemiconductor regions 186 and 189 are charge accumulating regions, andthe n type semiconductor regions 187 and 188 are photoelectricconversion regions.

Also, the solid-state imaging device 180 illustrated in FIG. 39 includesa first transfer transistor (Tr) for reading out electric charges of thePD 1, and a second transfer transistor (Tr) for reading out electriccharges of the PD 2.

The first transfer Tr is a planar Tr made up of a first transfer gateelectrode 183 formed via an insulating layer 195, and a first floatingdiffusion (FD) 191 for accumulating transferred signal charges.

The first FD 191 is made up of a second electroconductive type (n+ type)semiconductor region having high concentration, and is formed on thesurface of the semiconductor substrate 181 in a position facing the PD 1via the first transfer gate electrode 183.

The second transfer Tr is a vertical-type Tr made up of a secondtransfer gate electrode 184 formed via the insulating layer 195, and asecond floating diffusion (FD) 192 for accumulating transferred signalcharges.

The second transfer gate electrode 184 is configured of a planar gateelectrode 184A formed on the semiconductor substrate 181, and avertical-type gate electrode 184B formed in a columnar shape in thedepth direction from the surface of the semiconductor substrate 181below the planar gate electrode 184A.

The second FD 192 is made up of a second electroconductive type (n+type) semiconductor region having high concentration, and is formed onthe surface of the semiconductor substrate 181 in a position facing thePD 2 via the second transfer gate electrode 184.

Also, the first FD 191 and second FD 192 are formed in mutually facingpositions via the PD 1 and PD 2, respectively.

The PD 2 is formed generally on the entire surface between the secondpixel separation portion 194 and vertical-type gate electrode 184B.

The PD 1 is formed in a region between the first transfer gate electrode183 and the planar gate electrode 184A of the second transfer gateelectrode 184 at the center of the PD 2.

Also, with the n+ type semiconductor region 186 and n type semiconductorregion 187, the first transfer gate electrode 183 side is formed alongthe edge portion of the p+ type semiconductor region 185. Also, thesecond transfer gate electrode 184 side is formed with an intervalenough for preventing electric charges from being transferred from thePD 1 to the PD 2 at the time of applying voltage for readout to thesecond transfer gate electrode 184.

Also, a first pixel separation portion 193 and second pixel separationportion 194 for sectioning the increment pixels are formed with a firstelectroconductive type (p type) semiconductor region. The first andsecond pixel separation portions 193 and 194 are formed between adjacentpixels. The first pixel separation portion 193 is formed on the frontface 181A side of the semiconductor substrate 181, and the second pixelseparation portion 194 is formed on the rear face 181B of thesemiconductor substrate 181. The first and second pixel separationportions 193 and 194 are connected at the center of the semiconductorsubstrate 181 and are integrated. Also, the first FD 191 is formed inproximity to the first pixel separation portion 193 on the firsttransfer gate electrode 183 side. The second FD 192 is formed inproximity to the first pixel separation portion 193 on the secondtransfer gate electrode 184 side.

With the solid-state imaging device 180 thus configured, signal chargesaccumulated in the PD 1 are transferred to the first FD 191 by voltagebeing applied to the first transfer gate electrode 183. Also, signalcharges accumulated in the PD 2 are transferred to the second FD 192 byvoltage being applied to the second transfer gate electrode 184.

In this way, the solid-state imaging device 180 is configured whereinthe PD 1 and PD 2 are read out by separate transistors, respectively.

With the solid-state imaging device 180, the impurity concentration ofthe PD 2 is formed in the same way as with the PD 1. Therefore, thepotential of the n+ type semiconductor region 189 of the PD 2 is formedhigh in the same way as with the n+ type semiconductor region 186 of thePD 1. As a result thereof, with the PD 1 and PD 2, a sufficientpotential region up to a deep region is formed.

With the above-mentioned configuration of the solid-state imaging device180, the potential (voltage) immediately below the transfer gateelectrode 183 is changed by positive voltage being applied to the firsttransfer gate electrode 183 at the time of readout. The signal chargesaccumulated in the PD 1 are passed through below the first transfer gateelectrode 183 and transferred to the first FD 191.

Similarly, the potential (voltage) immediately below the transfer gateelectrode 184 is changed by positive voltage being applied to the secondtransfer gate electrode 184. The signal charges accumulated in the PD 2are passed through peripheral regions of the vertical-type gateelectrode 184B of the second transfer gate electrode 184 and transferredto the second FD 192.

Even with a configuration wherein the impurity concentration of the PD 2on the rear face side is high, and charge transfer depending on apotential slope according to the related art is not be performed,according to the vertical-type Tr, electric charges accumulated in then+ type semiconductor region 189 and n type semiconductor region 188 ofthe PD 2 are transferred to the second FD 192. In this way, according tothe configuration of the solid-state imaging device 180, the electriccharges of the PD 2 formed with the same impurity concentration as withthe PD 1 can be read out.

Also, in order to read out the electric charges of the PD 1, the planarTr is formed in the semiconductor substrate 181, and in order to readout the electric charges of the PD2, the vertical-type Tr is formed inthe semiconductor substrate 181. Therefore, the PD 1 and PD 2 can beread out separately.

For example, an arrangement may be made wherein light on thelong-wavelength side is detected at the PD 1, and light on theshort-wavelength side is detected at the PD 2. Also, a photoelectricconversion film is provided onto the rear face 181B of the semiconductorsubstrate 181, whereby light with intermediate wavelength of the PD 1and PD 2 can also be detected.

Accordingly, a color filter can be removed from the configuration of thesolid-state imaging device, and accordingly, light use efficiency can beimproved.

11. Solid-State Imaging Device Manufacturing Method According to FifthEmbodiment

Next, an example of a solid-state imaging device manufacturing methodaccording to the fifth embodiment will be described. Note that, withdescription of the following manufacturing method, the sameconfigurations as with the configurations of the solid-state imagingdevice 180 according to the fifth embodiment illustrated in the aboveFIG. 39 are denoted with the same reference numerals, and the details ofthe configurations will be omitted. Also, description will be omittedregarding the manufacturing method for the semiconductor substrate,wiring layers, other various types of transistors, and various elementsformed on the solid-state imaging device. These can be manufactured by amethod according to the related art.

First, as illustrated in FIG. 40A, the semiconductor substrate 181 isprepared. As for the semiconductor substrate 181, a Si substrate isemployed, for example. Insulating layers 195 and 196 for surfaceprotection made up of a thermally-oxidized film or the like are formedon the front face 181A and rear face 181B of the semiconductor substrate181.

Next, as illustrated in FIG. 40B, a resist layer 197 is formed on thefront face 181A of the semiconductor substrate 181. The resist layer 197is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the semiconductor substrate181 from the opening of the resist layer 197. According to this ioninjection, the first pixel separation portion 193 is formed on the frontface 181A side of the semiconductor substrate 181. Depth where the firstpixel separation portion 193 is formed is taken as a half or so of thethickness of the semiconductor substrate 181 at the time of finallyforming the solid-state imaging device 180.

Next, as illustrated in FIG. 40C, a resist layer 198 is formed on theface 181A of the semiconductor substrate 181. The resist layer 198 isformed with a pattern for opening a position where the vertical-typegate electrode 184B of the second transfer gate electrode 184 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, as illustrated in FIG. 41D, the semiconductor substrate 181 andinsulating layer 195 are subjected to etching from the opening of theresist layer 198 using anisotropic etching. A trench 199 is formed onthe semiconductor substrate 181. Further, as illustrated in FIG. 41E, aninsulating layer 195 made up of a thermally-oxidized film or the like isformed on the semiconductor substrate 181 exposed within the trench 199.

Next, after removing the resist layer 195, as illustrated in FIG. 41F, agate electrode material layer 200 made up of polysilicon or the like isformed on the semiconductor substrate 181. With this gate electrodematerial layer 200, after the trench 199 of the semiconductor substrate181 is embedded and formed, the surface is flattened using the CMPmethod or the like.

Next, as illustrated in FIG. 42G, a resist layer 201 is formed on thegate electrode material layer 200. The resist layer 201 is formed with apattern remaining on a position where the first transfer gate electrode183 and second transfer gate electrode 184 are formed, using thephotolithographic technique.

Next, as illustrated in FIG. 42H, the gate electrode material layer 200is subjected to etching with the resist layer 201 as a mask. Thus, thefirst transfer gate electrode 183 and second transfer gate electrode 184are formed. With the second transfer gate electrode 184, a portionformed within the trench 199 of the semiconductor substrate 181 servesas a vertical-type gate electrode 184B, and a portion formed on thesurface of the semiconductor substrate 181 serves as a planar gateelectrode 184A.

Next, as illustrated in FIG. 42I, a resist layer 202 is formed on thesemiconductor substrate 181. The resist layer 202 is formed with apattern for opening a position where the n+ type semiconductor region186 and n type semiconductor region 187 of the PD 1 of the solid-stateimaging device is formed, using the photolithographic technique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 181 from the opening of the resist layer 202.Ion injection is performed up to the depth of a half or so of thethickness of the semiconductor substrate 181 at the time of finallyforming the solid-state imaging device 180. According to this process,the n type semiconductor region 187 making up the PD 1 is formed in adeep portion of the semiconductor substrate 181.

Next, as illustrated in FIG. 43J, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 187 formed inthe previous process from the opening of the resist layer 202. Accordingto this ion injection, the n+ type semiconductor region 186 is formed.

Next, as illustrated in FIG. 43K, a resist layer 207 is formed on thesemiconductor substrate 181. The resist layer 207 is formed with apattern for opening a position where the p+ type semiconductor region185 of the PD 1 of the solid-state imaging device is formed, using thephotolithographic technique. A p type impurity is ion-injected from theopening of the resist layer 207. According to this ion injection, thefirst electroconductive type (P+ type) semiconductor region 185 isformed on the surface of the semiconductor substrate 181.

According to the above processes, the PD 1 is formed wherein the p+ typesemiconductor region 185, n+ type semiconductor region 186, and n typesemiconductor region 187 are laminated from the front face 181A side ofthe semiconductor substrate 181.

Also, with the above-mentioned PD 1 formation process, as for ioninjection of the n type impurity, in addition to the pattern of theresist layer 202, self alignment using the first transfer gate electrode183 is performed. Also, as for ion injection of the p type impurity,self alignment using the first transfer gate electrode 183 and secondtransfer gate electrode 184 is performed.

Next, as illustrated in FIG. 43L, a resist layer 203 is formed on thefront face 181A of the semiconductor substrate 181. The resist layer 203is formed in a position where the first FD 191 and second FD 192 of thesolid-state imaging device is formed, using the photolithographictechnique. Specifically, the resist layer 203 is formed with a patternfor opining the outer sides of the first pixel separation portions 193and 194 in a position facing the PD 1 via the first transfer gateelectrode 183 and second transfer gate electrode 184.

Next, an n type impurity is ion-injected into the semiconductorsubstrate 181 from the opening of the resist layer 203. According tothis ion injection, the first FD 191 and second FD 192 are formed on thefront face 181A side of the semiconductor substrate 181.

Next, as illustrated in FIG. 44M, a wiring layer 182 is formed on thefront face 181A of the semiconductor substrate 181. The wiring layer 182is formed by laminating an inter-layer insulating layer and anelectroconductive layer. Also, the electroconductive layer to beconnected to the gate electrode or PD or the like of the solid-stateimaging device is formed by passing through the inter-layer insulatinglayer.

Next, as illustrated in FIG. 44N, a supporting substrate 204 isconnected onto the wiring layer 182, and the semiconductor substrate 181is reversed. Next, as illustrated in FIG. 44O, the rear face 181B sideof the semiconductor substrate 181 is removed using the CMP or the like.The semiconductor substrate 181 is formed in predetermined thickness byremoving the rear face 181B side of the semiconductor substrate 181. Theinsulating layer 196 for surface protection made up of athermally-oxidized film or the like is formed on the rear face 181B ofthe semiconductor substrate 181 again.

Next, as illustrated in FIG. 45P, a resist layer 205 is formed on therear face 181B of the semiconductor substrate 181. The resist layer 205is formed with a pattern for opening a position where a pixel separationregion for sectioning between pixels of the solid-state imaging deviceis formed, using the photolithographic technique.

Next, a p type impurity is ion-injected into the rear face 181B side ofthe semiconductor substrate 181 from the opening of the resist layer205. According to this ion injection, the second pixel separationportion 194 is formed on the rear face 181B side of the semiconductorsubstrate 181. The second pixel separation portion 194 is formed fromdepth whereby the second pixel separation portion 194 comes into contactwith the already formed first pixel separation portion 193, to the rearface 181B.

According to this process, the pixel separation region made up of thefirst pixel separation portion 193 and second pixel separation portion194 is formed from the front face 181A to rear face 181B of thesemiconductor substrate 181.

Next, as illustrated in FIG. 45Q, a resist layer 206 is formed on therear face 181B of the semiconductor substrate 181. The resist layer 206is formed with a pattern for opening a position where the PD 2 of thesolid-state imaging device is formed, using the photolithographictechnique.

Next, an n type impurity is ion-injected into a deep position of thesemiconductor substrate 181 from the opening of the resist layer 206.Ion injection is performed up to the depth of a half or so of thethickness of the semiconductor substrate 181 at the time of finallyforming the solid-state imaging device 180. Next, the n typesemiconductor region 188 making up the PD 2 is formed in a positionconnecting to the n type semiconductor region 187 by diffusing theimpurity up to a position connecting to the already formed n typesemiconductor region 187 of the PD 1.

Next, as illustrated in FIG. 45R, an n type impurity is ion-injectedinto a shallow region on the n type semiconductor region 188 formed inthe previous process from the opening of the resist layer 206. Accordingto this ion injection, the n+ type semiconductor region 189 having highconcentration is formed.

Next, as illustrated in FIG. 46S, a p type impurity is ion-injected fromthe opening of the resist layer 206. According to this ion injection,the p+ type semiconductor region 190 having high concentration is formedon the rear face 181B of the semiconductor substrate 181.

According to the above processes, there is formed the PD 2 having aconfiguration wherein the p+ type semiconductor region 190, n+ typesemiconductor region 189, and n type semiconductor region 188 arelaminated from the rear face 181B side of the semiconductor substrate181.

Next, as illustrated in FIG. 46T, the semiconductor substrate 181 wherethe PD 1 and PD 2 and so forth are formed is subjected to heat treatmentaccording to laser annealing or the like from the rear face 181B side.For example, activation of an impurity formed within the semiconductorsubstrate 181 is performed by heat treatment of 1000° C.

According to the above processes, the solid-state imaging deviceaccording to the present embodiment can be manufactured.

With the above-mentioned solid-state imaging device manufacturing methodaccording to the present embodiment, in the same way as with the firstembodiment, the PD 1 and PD 2 are formed from the front face 181A sideand rear face 181B side of the semiconductor substrate 181 using ioninjection, respectively. Therefore, diffusion of an impurity due to ioninjection to a deep portion of the semiconductor substrate can beprevented, and the saturation signal amount can be increased.

Also, according to the above-mentioned manufacturing method according tothe present embodiment, with a process for injecting a p type impurityto form pixel separation, ion injection is performed from the front face181A side and rear face 181B side of the semiconductor substrate 181 toform the first and second pixel separation portions 193 and 194. Thus,diffusion of an impurity to be generated at the time of performing ioninjection up to a deep region of the substrate can be suppressed, andaccordingly, a solid-state imaging device with color mixture beingprevented from easily occurring can be manufactured.

12. Sixth Embodiment Configuration of Solid-State Imaging Device ExampleWherein a Potential Adjustment Region is Provided

FIGS. 47A and 47B are diagrams illustrating the configuration of asolid-state imaging device 41-1 according to a sixth embodiment, andFIG. 47A is a schematic plan view of one pixel worth in a solid-stateimaging apparatus, and FIG. 47B is a schematic cross-sectional viewequivalent to XLVIIB-XLVIIB cross-section in FIG. 47A. Hereinafter, theconfiguration of the solid-state imaging device 41-1 according to thesixth embodiment will be described based on these drawings.

The solid-state imaging device 41-1 according to the sixth embodimentillustrated in FIGS. 47A and 47B are disposed in each pixel of the abovesolid-state imaging apparatus. A semiconductor substrate 413 is disposedin the upper portion of a supporting substrate 42 via an insulating film411, and multiple photoelectric conversion regions 415 r, 415 g, and 415b are provided within this semiconductor substrate 413. Also, twotrenches 417 r and 417 g are provided beside the photoelectricconversion regions 415 r, 415 g, and 415 b within this semiconductorsubstrate 413. Embedding-type readout gates 421 r and 421 g are providedwithin these trenches 417 r and 417 g via a gate insulating film 419.Also, a readout gate 421 b (see plan view) is provided in the upperportion of the semiconductor substrate 413 via the gate insulating film419.

Further, three floating diffusions 423 are disposed in proximity to thereadout gates 421 r, 421 g, and 421 b on the surface layer of thesemiconductor substrate 413. In particular, in the present sixthembodiment, potential adjustment regions 425 r and 425 g are providedbetween the photoelectric conversion regions 415 r and 415 g, and thegate insulating film 419.

Next, description will be made regarding the detailed configuration ofeach component disposed in the semiconductor substrate 413, and theinner and upper portions thereof.

Semiconductor Substrate 413

The semiconductor substrate 413 is a semiconductor thin film configuredof monocrystalline silicon, for example. Here, the semiconductorsubstrate 413 is configured of n type monocrystalline silicon inparticular, and accordingly, the entire semiconductor substrate 413 isemployed as an n well. N type concentration in such a semiconductorsubstrate 413 is a slightly thin “n−”. Now, let us say that the n typeconcentration indicated here is not n-type-impurity-containedconcentration itself but substantial n type concentration. Accordingly,even with a region of which the n-type-impurity-contained concentrationis high, in the event that p-type-impurity-contained concentration ishigh in the region thereof, the substantial n-type concentration becomeslow. This will also be true in the following.

Also, with the present sixth embodiment, a face opposite of thesupporting substrate 42 at the semiconductor substrate 413 is taken as alight receiving face A as to the photoelectric conversion regions 415 r,415 g, and 415 b.

Photoelectric Conversion Regions 415 r, 415 g, and 415 b

The photoelectric conversion regions 415 r, 415 g, and 415 b areimpurity regions laminated and disposed in the depth direction thereofwithin the semiconductor substrate 413, and the planar shape of thesemiconductor substrate 413 is, for example, a square as viewed from thelight receiving face A side. Of these photoelectric conversion regions415 r, 415 g, and 415 b, the photoelectric conversion region 415 r forconverting light of a red region is disposed in the deepest position ofthe semiconductor substrate 413 and the closest position to thesupporting substrate 42. Also, the photoelectric conversion region 415 gfor converting light of a green region is disposed in the upper portionthereof. The photoelectric conversion region 415 b for converting lightof a blue region is disposed closest to the surface of the semiconductorsubstrate 413. These are disposed, in order from the supportingsubstrate 42 side, in a longer wavelength order corresponding to thephotoelectric conversion region 415 r for red, photoelectric conversionregion 415 g for green, and photoelectric conversion region 415 b forblue.

Also, the photoelectric conversion region 415 r disposed in the deepestportion may be extended in the downward of a later-described trench 417g.

The photoelectric conversion regions 415 r, 415 g, and 415 b thusdisposed are the same n type impurity regions as with the semiconductorsubstrate 413, and the n type concentration thereof is deeper (n+) thanthat of the semiconductor substrate 413. Such photoelectric conversionregions 415 r, 415 g, and 415 b are deeper in potential as compare tothe semiconductor substrate 413 in a range where there is no electricfield influence.

Also, a p type region 416 is disposed between the photoelectricconversion regions 415 r, 415 g, and 415 b, and above the photoelectricconversion region 415 b which is the top layer in a state adjacent tothese. Thus, there is configured a photodiode having a pn junctionbetween the n type photoelectric conversion regions 415 r, 415 g, and415 b, and any p type region 416 adjacent to these. The pn junctionportion between the n type photoelectric conversion regions 415 r, 415g, and 415 b, and the p type region 416 is disposed in the depthcorresponding to the wavelength dependence of the optical absorptioncoefficient of light input from the light receiving face A. However, thep type region 416 of the top layer may be provided as a layer forsuppressing the interface state.

The p type concentration in these p type regions 416 is deep [p+]. Notethat the p type concentration indicated here is notp-type-impurity-contained concentration itself but substantial p typeconcentration, which is the same as with the n type concentration.

Trenches 417 r and 417 g

The trenches 417 r and 417 g are independently provided beside thephotoelectric conversion regions 415 r, 415 g, and 415 b with aninterval as to these. For example, these trenches 417 r and 417 g aredisposed in a position sandwiching the photoelectric conversion regions415 r, 415 g, and 415 b of which the planar shapes are squares from thediagonal direction.

Of these two trenches 417 r and 417 g, one trench 417 r is providedpassing through the semiconductor substrate 413, and the other trench417 g is formed in a recessed portion shape having the bottom withoutpassing through the semiconductor substrate 413. The depth of the trench417 g having a recessed portion shape is at least deeper than thephotoelectric conversion region 415 g for green and shallower than thephotoelectric conversion region 415 r for red. Thus, the photoelectricconversion region 415 r for red provided to the deepest portion of thesemiconductor substrate 413 can be extended to the downward of thetrench 417 g, and signal charge amount to be accumulated in thephotoelectric conversion region 415 r can be increased.

Gate Insulating Film 419

The gate insulating film 419 is provided covering the inner wall of thetrenches 417 r and 417 g, and above the light receiving face A of thesemiconductor substrate 413. This gate insulating film 419 is configuredof a silicon oxide film obtained by silicon being subjected to thermaloxidation, silicon oxide nitride film, or high dielectric insulatingfilm, for example. The high dielectric insulating film is configured ofhafnium oxide, hafnia silicate, nitrogen addition hafnium aluminate,tantalum oxide, titanium dioxide, zirconium oxide, praseodymium oxide,yttrium oxide, or the like. Such each material film is employed as thegate insulating film 419 in a single layer or laminated layer state asappropriate.

Readout Gates 421 r and 421 g

The readout gates 421 r and 421 g are provided as embedding electrodesembedded in the inner portions of the trenches 417 r and 417 g via thegate insulating film 419, and are subjected to patterning in the upwardof the light receiving face A of the semiconductor substrate 413. Suchreadout gates 421 r and 421 g are configured of polysilicon (PhosphorusDoped Amorphous Silicon: PDAS) including an impurity such as phosphorus(P) or the like, or a metal material such as aluminum, tungsten, titan,cobalt, hafnium, tantalum, or the like.

Readout Gate 421 b

The readout gate 421 b is provided to the upward of the light receivingface A of the semiconductor substrate 413 via the gate insulating film419. This readout gate 421 b is disposed with an interval as to thereadout gates 421 r and 421 g serving as embedding electrodes, and aresubjected to patterning with a predetermined interval as to thephotoelectric conversion region 415 b for blue of the top layer. Such areadout gate 421 b may be configured of the same material layer as withthe read out gates 421 r and 421 g.

Floating Diffusion 423

The floating diffusion 423 is an impurity region provided to the surfacelayer on the light receiving face A side of the semiconductor substrate413, and are provided in a position sandwiching the readout gates 421 r,421 g, and 421 b as to the photoelectric conversion regions 415 r, 415g, and 415 b. The floating diffusions 423 thus disposed are the same ntype impurity regions as with the semiconductor substrate 413 andphotoelectric conversion regions 415 r, 415 g, and 415 b, and the n typeconcentration thereof is deeper (n+) than that of the semiconductorsubstrate 413.

Potential Adjustment Regions 425 r and 425 g

The potential adjustment regions 425 r and 425 g are provided betweenthe photoelectric conversion regions 415 r and 415 g disposed in a deepposition of the semiconductor substrate 413, and the gate insulatingfilm 419 covering the side walls of the trenches 417 r and 417 g. Ofthese, one potential adjustment region 425 r is disposed between thephotoelectric conversion region 415 r for red and the trench 417 r in amanner adjacent to these, and is provided to the same deep region aswith the photoelectric conversion region 415 r. This potentialadjustment region 425 r is disposed with an interval between the otherphotoelectric conversion regions 415 g and 415 b, and the floatingdiffusion 423. Also, the other potential adjustment region 425 g isdisposed between the photoelectric conversion region 415 g for green andthe trench 417 g in a manner adjacent to these, and is provided to thesame deep region as with the photoelectric conversion region 415 g. Thispotential adjustment region 425 g is disposed with an interval betweenthe other photoelectric conversion regions 415 r and 415 b, and thefloating diffusion 423.

The potential adjustment regions 425 r and 425 g thus disposed are thesame n type impurity regions as with the semiconductor substrate 413 andthe photoelectric conversion regions 415 r, 415 g, and 415 b, and the ntype concentration thereof is further thinner (n−−) than that of thesemiconductor substrate 413. Such potential adjustment regions 425 r and425 g are shallower in potential as compared to the semiconductorsubstrate 413 and photoelectric conversion regions 415 r, 415 g, and 415b in a range where there is no electric field influence.

Driving of Solid-State Imaging Device

FIGS. 48A and 48B are diagrams for describing driving of the solid-stateimaging device 41-1 having the above configuration, and illustrate thepotential for a light reception period and a readout period at thephotoelectric conversion region 415 r for red as an example. (1) and (2)in FIG. 48A are potential at a deep position of the photoelectricconversion region 415 r. On the other hand, (1) and (2) in FIG. 48B arepotential in a channel formation region along the gate insulating film419. Also, (1) in FIG. 48A and (1) in FIG. 48B correspond to the lightreception period (gate voltage is off), and (2) in FIG. 48A and (2) inFIG. 48B correspond to the readout period (gate voltage is on).Hereinafter, along with these drawings, driving of the solid-stateimaging device 41-1 according to the sixth embodiment will be describedwith reference to the previous FIGS. 47A and 47B.

First, with the light reception period, gate voltage to be applied tothe readout gate 421 r is turned off. Therefore, as illustrated in (1)in FIG. 48A, the potential of the photoelectric conversion region 415 rof which the n type concentration is deeper (n+) is kept deeper than thepotential of the potential adjustment region 425 r of which theconcentration is (n−−). Thus, a signal charge e generated byphotoelectric conversion is accumulated in the photoelectric conversionregion 415 r.

On the other hand, as illustrated in (1) in FIG. 48B, with the channelformation region along the gate insulating film 419, the potential ofthe potential adjustment region 425 r of which the n type concentrationis significantly thin (n−−) is kept shallower than the potential of thesemiconductor substrate 413 of which the n type concentration isslightly thin (n−).

Next, with the readout period, plus gate voltage to be applied to thereadout gate 421 r is turned on. At this time, the potential adjustmentregion 425 r disposed adjacent to the gate insulating film 419 isintensely affected by the electric field due to gate voltage as comparedto the photoelectric conversion region 415 r.

Therefore, as illustrated in (2) in FIG. 48A, gate voltage is set sothat the potential of the potential adjustment region 425 r is deeperthan the potential of the photoelectric conversion region 415 r. Thus,the signal charge e of the photoelectric conversion region 415 r is readout to the potential adjustment region 425 r.

On the other hand, as illustrated in (2) in FIG. 48B, the potentialadjustment regions 425 r and semiconductor substrate 413 disposed alongthe gate insulating film 419 are affected by the gate voltage to beapplied to the readout gate 421 r with the same intensity. Therefore,the potential depth relation between the potential adjustment region 425r and semiconductor substrate 413 globally becomes deep in a kept statein the same way as with the light reception period. Accordingly, thesignal charge e read out to the potential adjustment region 425 r isread out by the semiconductor substrate 413 having further deeppotential. At this time, drain voltage is applied to the floatingdiffusion 423 disposed in proximity to the readout gate 421 r so as toobtain deeper potential than that of the semiconductor substrate 413.Thus, the signal charge e of the photoelectric conversion region 415 ris read out to the floating diffusion 423.

Driving as described above is similarly applied to driving of thephotoelectric conversion region 415 g for green. Also, driving of thephotoelectric conversion region 415 b for blue may be performed in thesame way as with the case employing a normal surface channel typereadout gate.

Solid-State Imaging Device Manufacturing Method

FIGS. 49A through 50C are cross-section process diagrams for describingmanufacturing procedures for the solid-state imaging device 41-1 havingthe above configuration. Hereinafter, the manufacturing procedures forthe solid-state imaging device 41-1 according to the sixth embodimentwill be described based on these drawings.

FIG. 49A

First, as illustrated in FIG. 49A, a thin film shaped semiconductorsubstrate 413 provided to the upper portion of the supporting substrate42 via an insulating film 411 is prepared. Let us say that thissemiconductor substrate 413 is configured of n type monocrystallinesilicon, and the n type concentration thereof is slightly thin (n−).

FIG. 49B

Next, as illustrated in FIG. 49B, each electroconductive type impurityis introduced into the semiconductor substrate 413, thereby forming thephotoelectric conversion regions 415 r, 415 g, and 415 b, the p typeregion 416, and the potential adjustment regions 425 r and 425 g withinthe semiconductor substrate 413 of which the n type concentration isslightly thin (n−).

At this time, with formation of the photoelectric conversion regions 415r, 415 g, and 415 b, an n type impurity is further introduced into thedeep regions of the semiconductor substrate 413. Thus, the photoelectricconversion regions 415 r, 415 g, and 415 b of which the n typeconcentration is deep (n+) are formed.

Also, with formation of the potential adjustment regions 425 r and 425g, a p type impurity is introduced into the deep regions of thesemiconductor substrate 413. Thus, the potential adjustment regions 425r and 425 g of which the n type concentration is substantially thin(n−−) are formed in a state adjacent to the photoelectric conversionregions 415 r and 415 g.

Further, with formation of the p type regions 416, a p type impurity ofwhich the electroconductive type is inverted and becomes deep [p+] isintroduced into the deep regions of the semiconductor substrate 413.Thus, the p type regions 416 are formed.

With introduction of the impurities into the semiconductor substrate 413such as described above, the area is restricted by a mask, and alsointroduction is performed by ion injection of the impurities of whichthe depths are adjusted by injection energy, and activation heattreatment thereafter. Note that ion injection may be performed in apredetermined order, and the activation heat treatment may be performedafter all of the ion injections are completed.

FIG. 49C

Thereafter, as illustrated in FIG. 49C, trenches 417 r and 417 g areformed in the semiconductor substrate 413. At this time, according toetching employing a resist pattern omitted in the drawing as a mask, thetrench 417 r adjacent to the potential adjustment region 425 r is formedin a state passing through the semiconductor substrate 413. Also,according to etching employing another resist pattern as a mask, thetrench 417 g adjacent to the potential adjustment region 425 g and alsohaving depth not reaching the photoelectric conversion region 415 r isformed in the semiconductor substrate 413.

FIG. 50A

Next, as illustrated in FIG. 50A, the gate insulating film 419 is formedin a state covering the inner walls of the trenches 417 r and 417 g andabove the semiconductor substrate 413. Film formation of the gateinsulating film 419 is performed by a method selected as appropriatewith a material making up the gate insulating film 419. For example, asilicon oxide film or silicon oxide nitride film is formed by thermaloxidation or thermal nitriding of the semiconductor substrate 413, and ahafnium oxide film or the like is formed by anatomic-layer-vapor-deposition method.

Thereafter, in a state in which the trenches 417 r and 417 g areembedded, an electroconductive material film 421 is formed on the gateinsulating film 419. Film formation of the electroconductive materialfilm 421 is performed by a method selected as appropriate with amaterial making up the electroconductive material film 421. For example,in the case of a polysilicon film including an impurity such asphosphorous (P) or the like, film formation is performed by a scientificvapor phase growth method, and in the case of a metal material film suchas aluminum, tungsten, titan, cobalt, hafnium, tantalum, or the like,film formation is performed by a spattering method.

FIG. 50B

Next, as illustrated in FIG. 50B, the electroconductive material film421 is subjected to pattern matching. Thus, the readout gate 421 rembedded in the trench 417 r, the readout gate 421 g embedded in thetrench 417 g, and the readout gate (421 b) on the light receiving face Aof the semiconductor substrate 413 of which the drawing is omitted hereare formed. At this time, it is desirable to subject theelectroconductive material film 421 to etching using a resist pattern ofwhich the drawing is omitted as a mask. Thereafter, in order toterminate an interface state between the gate insulating film 419 andthe semiconductor substrate 413 as appropriate, the gate insulating film419 and the semiconductor substrate 413 are subjected to annealingprocessing within chlorine atmosphere.

FIG. 50C

Thereafter, as illustrated in FIG. 50C, an insulating side wall 422 isformed on the side walls of the readout gates 421 r, 421 g, (and 421 b).This side wall 422 is formed by film formation of an insulating filmsuch as a silicon oxide film, silicon nitride film or the like, and etchback of the insulating film thereafter. Thereafter, a floating diffusion423 is formed in a position sandwiching the readout gates 421 r, 421 g,(and 421 b) as to the photoelectric conversion regions 415 r, 415 g, and415 b in the surface layer on the light receiving face A side of thesemiconductor substrate 413. At this time, an impurity is introducedinto the surface layer of the semiconductor substrate 413 with theresist pattern and side wall 422 which are omitted in the drawing as amask, thereby forming the floating diffusion 423 of which the n typeconcentration is deep (n+) is formed beside the side wall 422 byself-alignment.

In this way, the solid-state imaging device 41-1 previously describedwith reference to FIGS. 47A and 47B is obtained.

Advantage of Sixth Embodiment

The solid-state imaging device 41-1 according to the sixth embodimentdescribed above has a configuration wherein the potential adjustmentregions 425 r and 425 g of which the n type concentration is thinner(n−−) than those of the photoelectric conversion regions 415 r and 415 gand semiconductor substrate 413 are provided between the photoelectricconversion regions 415 r and 415 g, and the gate insulating film 419.Thus, the potential of the channel formation region along the gateinsulating film 419 can be set deeper at the semiconductor substrate 413as compared to the potential adjustment regions 425 r and 425 g, thesignal charges (electrons) of the potential adjustment regions 425 r and425 g can be read out to the semiconductor substrate 413 withoutobstacles. As a result thereof, with the solid-state imaging device 41-1where the photoelectric conversion regions 415 r and 415 g are providedto a deep position of the semiconductor substrate 413, all of the signalcharges of the photoelectric conversion regions 415 r and 415 g can beread out, and accordingly, improvement in imaging properties can berealized by preventing afterimage.

Here, as a comparative example FIG. 51 illustrates the cross-sectionalview of a solid-state imaging device having a configuration including nopotential adjustment region. Also, FIGS. 52A and 52B illustrate diagramsfor describing driving of the solid-state imaging device illustrated inFIG. 51. With the solid-state imaging device to which no potentialadjustment region is provided, with the light reception period, asillustrated in (1) in FIG. 52A and (1) in FIG. 52B, the potential of thephotoelectric conversion region 415 r of which the n type concentrationis deep (n+) is kept deeper than the potential of the semiconductorsubstrate 413 of which the concentration is (n−). Thus, the signalcharge e generated by photoelectric conversion is accumulated in thephotoelectric conversion region 415 r.

Also, with the readout period, gate voltage to be applied to the readoutgate 421 r is turned on, and accordingly, as illustrated in (2) in FIG.52A, potential on the gate insulating film 419 side in the photoelectricconversion region 415 r is deepened. Thus, the signal charge e of thephotoelectric conversion region 415 r is read out to the gate insulatingfilm 419 side. However, as illustrated in (2) in FIG. 52B, with thechannel formation region along the gate insulating film 419, thepotential depth relation between the photoelectric conversion region 415r and the semiconductor substrate 413 is entirely deepened in a statekept in the same way as with the light reception period. Therefore, withthe photoelectric conversion region 415 r, the potential is still deeperthan that of the semiconductor substrate 413, and the signal charge e isremained in the photoelectric conversion region 415 r.

13. Seventh Embodiment Configuration of Solid-State Imaging Device

Example wherein a pinning region overlapped with a potential adjustmentregion is provided

FIGS. 53A and 53B are diagrams illustrating the configuration of asolid-state imaging device 41-2 according to a seventh embodiment. FIG.53A is a schematic plan view of one pixel worth in the solid-stateimaging apparatus, and FIG. 53B is a schematic cross-sectional viewequivalent to LIIIB-LIIIB cross-section in FIG. 53A. The solid-stateimaging device 41-2 according to the seventh embodiment illustrated inthese drawings differs from the sixth embodiment in that a pinningregion 431 is provided to the inner wall layers of the trenches 417 rand 417 g, and other configurations are the same as with the sixthembodiment.

Specifically, the pinning regions 431 are impurity regions providedalong the inner wall of the trenches 417 r and 417 g within thesemiconductor substrate 413, and are provided as layers for suppressingan interface state. Such pinning regions 431 are configured as a p typeimpurity region which is an inverse electroconductive type of thesemiconductor substrate 413. The p type concentration in the pinningregions 431 is deep [p+].

The pinning regions 431 as described above serve as overlapped regions431′ partially overlapped with the potential adjustment regions 425 rand 425 g at the same height as the potential adjustment regions 425 rand 425 g. Such overlapped regions 431′ include an impurity making upthe potential adjustment regions 425 r and 425 g of which the n typeconcentration is (n−−), and an impurity making up the pinning regions431 of which the p type concentration is [p+]. Accordingly, the p typeconcentration in the overlapped regions 431′ is slightly thin [p−], andis thinner than the p type concentration of the pinning regions 431.

Here, with the potential adjustment regions 425 r and 425 g, only aportion of the gate insulating film 419 side may be overlapped with thepinning regions 431 as illustrated, or the entirety thereof may bedisposed in a manner overlapped with the pinning regions 431.

Driving of Solid-State Imaging Device

FIGS. 54A and 54B are diagrams for describing driving of the solid-stateimaging device 41-2 having the above configuration, and illustrate thepotential for a light reception period and a readout period at thephotoelectric conversion region 415 r for red as an example. (1) and (2)in FIG. 54A are potential at a deep position of the photoelectricconversion region 415 r. On the other hand, (1) and (2) in FIG. 54B arepotential in a channel formation region along the gate insulating film419. Also, (1) in FIG. 54A and (1) in FIG. 54B correspond to the lightreception period (gate voltage is off), and (2) in FIG. 54A and (2) in54B correspond to the readout period (gate voltage is on). Hereinafter,along with these drawings, driving of the solid-state imaging device41-2 according to the seventh embodiment will be described withreference to the previous FIGS. 53A and 53B.

First, with the light reception period, gate voltage to be applied tothe readout gate 421 r is turned off. Therefore, as illustrated in (1)in FIG. 54A, the potential in the depth position of the photoelectricconversion region 415 r becomes shallower in the sequence of thephotoelectric conversion region 415 r of which the n type concentrationis deep (n+), the potential adjustment region 425 r of which the n typeconcentration is (n−−), and the overlapped region 431′ of which the ptype concentration is slightly thinner [p−]. Thus, a signal charge egenerated by photoelectric conversion is accumulated in thephotoelectric conversion region 415 r.

On the other hand, as illustrated in (1) in FIG. 54B, the potential inthe channel formation region along the gate insulating film 419 becomesshallower in the sequence of the overlapped region 431′ of which the ptype concentration is slightly thinner [p−], and the pinning region 431of which the p type concentration is deep [p+]. This step followsdifference in the p type concentration. Here, the overlapped region 431′is a region where the pinning region 431 of which the p typeconcentration is deep [p+], and the potential adjustment region 425 r ofwhich the n type concentration is significantly thinner (n−−) areoverlapped. Therefore, the p type concentration of the overlapped region431′ is small in difference with the p type concentration of the pinningregion 431, and the step thereof is not so great.

Next, with the readout period, plus gate voltage to be applied to thereadout gate 421 r is turned on. At this time, the potential adjustmentregion 425 r and overlapped region 431′ disposed on the readout gate 421r side are intensely affected by electric field due to the gate voltageas compared to the photoelectric conversion region 415 r.

Therefore, as illustrated in (2) in FIG. 54A, the gate voltage is set sothat the potentials of the potential adjustment region 425 r andoverlapped region 431′ become deeper than that of the photoelectricconversion region 415 r. Thus, the signal charge e of the photoelectricconversion region 415 r is read out to the potential adjustment region425 r and overlapped region 431′.

On the other hand, as illustrated in (2) in FIG. 54B, the overlappedregion 431′ disposed along the gate insulating film 419, and the pinningregion 431 are affected by the gate voltage to be applied to the readoutgate 421 r with the same intensity. Therefore, the potential depthrelation between the overlapped region 431′ and the pinning region 431globally becomes deep in a kept state in the same way as with the lightreception period. Accordingly, the signal charge e read out to theoverlapped region 431′ is read out to the pinning region 431 byovercoming a small step of the pinning region 431 of which the p typeconcentration is deep [p+] from the overlapped region 431′ of which thep type concentration is slightly thin [p−]. At this time, drain voltageis applied to the floating diffusion 423 disposed in proximity to thereadout gate 421 r such that the potential is deeper than thesemiconductor substrate 13. Thus, the signal charge e of thephotoelectric conversion region 415 r is read out to the floatingdiffusion 423.

Driving as described above is similarly applied to driving of thephotoelectric conversion region 415 g for green. Also, driving of thephotoelectric conversion region 415 b for blue may be performed in thesame way as with the case employing a normal surface channel typereadout gate.

Solid-State Imaging Device Manufacturing Method

FIGS. 55A through 56B are cross-section process diagrams for describingmanufacturing procedures for the solid-state imaging device 41-2 havingthe above configuration. Hereinafter, the manufacturing procedures forthe solid-state imaging device 41-2 according to the seventh embodimentwill be described based on these drawings.

FIG. 55A

First, as illustrated in FIG. 55A, a procedure is performed in the sameway as with the sixth embodiment wherein the photoelectric conversionregions 415 r, 415 g, and 415 b, p type regions 416, and the potentialadjustment regions 425 r and 425 g are formed and further the trenches417 r and 417 g are formed in the semiconductor substrate 413.

FIG. 55B

Next, as illustrated in FIG. 55B, a p type impurity is introduced intothe semiconductor substrate 413 of which the n type concentration isslightly thin (n−) from the inner walls of the trenches 417 r and 417 g,thereby forming the pinning region 431 of which the p type concentrationis slightly deep [p+] on the inner walls of the trenches 417 r and 417g. Thus, the p type impurity is also introduced into the potentialadjustment regions 425 r and 425 g exposed in the inner walls of thetrenches 417 r and 417 g, and the overlapped region 431′ of which the ptype concentration is slightly thin [p−] is formed in this portion.

Introduction of p type impurities such as described above is performed,along with the area being restricted by a mask, by oblique ion injectionof the impurities each of which the depth is adjusted by injectionenergy, and activation heat treatment thereafter. At this time,according to ion injection energy being adjusted, overlapping of thepinning region 431 as to the potential adjustment regions 425 r and 425g is adjusted so that the pinning region 431 is overlapped with aportion or the entirety of the potential adjustment regions 425 r and425 g. Ion injection energy is adjusted so that the pinning region 431is not formed in a range exceeding the potential adjustment regions 425r and 425 g. Thereafter, the same procedures as with the proceduresdescribed with reference to FIGS. 50A through 50C in the sixthembodiment are performed.

FIG. 55C

Specifically, first, as illustrated in FIG. 55C, the gate insulatingfilm 419 is formed in a state covering the inner walls of the trenches417 r and 417 g, and above the semiconductor substrate 413. Next, theelectroconductive material film 421 is formed on the gate insulatingfilm 419 in a state in which the trenches 417 r and 417 g are embedded.

FIG. 56A

Next, as illustrated in FIG. 56A, the electroconductive material film421 is subjected to pattern etching, thereby forming the readout gate421 r within the trench 417 r, and forming the readout gate 421 g withinthe trench 417 g, and further forming the readout gate (421 b) of whichthe drawing is omitted here on the light receiving face A.

FIG. 56B

Thereafter, as illustrated in FIG. 56B, the insulating side wall 422 isformed on the side walls of the readout gates 421 r, 421 g, (and 421 b),and subsequently, the floating diffusion 423 of which the n typeconcentration is deep (n+) is formed on the surface layer of the lightreceiving face A side of the semiconductor substrate 413.

The solid-state imaging device 41-2 having the configuration previouslydescribed with reference to FIGS. 53A and 53B is thus obtained.

Advantage of Seventh Embodiment

The solid-state imaging device 41-2 according to the seventh embodimentdescribed above has a configuration wherein a p type pinning region 431is further provided to the inner walls of the trenches 417 r and 417 gto which the readout gates 421 r and 421 g are internally provided as tothe configuration of the sixth embodiment. Thus, as will be describednext, the potential step of the channel formation region along the gateinsulating film 419 can be lowered as compared to the case of providingno potential adjustment regions 425 r and 425 g of which the n typeconcentration is significantly thinner (n−−) than those of thephotoelectric conversion regions 415 r and 415 g.

Accordingly, the signal charges (electrons) further read out to theoverlapped region 431′ via the potential adjustment regions 425 r and425 g from the photoelectric conversion regions 415 r and 415 g canfurther readily be read out to the pinning region 431 from theoverlapped region 431′. As a result thereof, with the solid-stateimaging device 41-2 in which the photoelectric conversion regions 415 rand 415 g are provided to a deep position of the semiconductor substrate413, all of the signal charges of the photoelectric conversion regions415 r and 415 g can be read out, and accordingly, improvement in imagingproperties can be realized.

Here, as a comparative example FIG. 57 illustrates a cross-sectionalview of a solid-state imaging device having a configuration including nopotential adjustment region. Also, FIGS. 58A and 58B illustrate diagramsfor describing driving of the solid-state imaging device illustrated inFIG. 57. With the solid-state imaging device to which no potentialadjustment region is provided, there is provided an overlapped region431″ of which the p type concentration is significantly thin [p−−]wherein the photoelectric conversion regions 415 r and 415 g of whichthe n type concentration is deep (n+), and the pinning region 431 ofwhich the p type concentration is deep [p+] are overlapped.

With the light reception period of such a solid state imaging device, asillustrated in (1) in FIG. 58A, the potential of the photoelectricconversion region 415 r of which the n type concentration is deep (n+)is kept deeper than the potential of the overlapped region 431″ of whichthe p type concentration is significantly thin [p−−]. Thus, the signalcharge e generated by photoelectric conversion is accumulated in thephotoelectric conversion region 415 r.

On the other hand, as illustrated in (1) in FIG. 58B, the potential ofthe pinning region 431 of which the p type concentration is deep [p+] isshallower than the potential of the overlapped region 431″ of which thep type concentration is significantly thin [p−−]. Here, the overlappedregion 431″ is a region where the pinning region 431 of which the p typeconcentration is deep [p+], and the photoelectric conversion region 415r of which the n type concentration is deep (n+) are overlapped.Therefore, difference between the p type concentration of the overlappedregion 431″ and the p type concentration of the pinning region 431 isgreat, and the potential step thereof is greater than that in thesolid-state imaging device according to the seventh embodiment describedwith reference to FIGS. 53A and 54B.

Next, with the readout period, gate voltage to be applied to the readoutgate 421 r is turned on, and accordingly, as illustrated in (2) in FIG.58A, the potential of the overlapped region 431″ which is [p−−] is setso as to be greater than that of the photoelectric conversion region 415r which is (n+). Thus, the signal charge e of the photoelectricconversion region 415 r is read out to the gate insulating film 419side. However, as illustrated in (2) in FIG. 58B, with a portionadjacent to the gate insulating film 419, the potential depth relationbetween the overlapped region 431″ and the pinning region 431 isglobally deepened in a state kept in the same way as with the lightreception period. Therefore, the potential of the pinning region 431which is [p+] is shallower than the potential of the overlapped region431″ which is [p−−], and a great step is remained. Accordingly, thesignal charge e is remained in the overlapped region 431″.

14. Modifications

FIGS. 59A through 59C illustrate cross-sectional views of first throughthird modifications of the solid-state imaging device according to thepresent technology. Hereinafter, based on these drawings, themodifications of the solid-state imaging device will be described. Notethat, though FIGS. 59A through 59C illustrate configurations wherein themodifications have been applied to the solid-state imaging device 41-1according to the first embodiment, the modifications may similarly beapplied to the solid-state imaging device 41-2 according to the seventhembodiment.

First Modification

FIG. 59A illustrates, as the first modification of the solid-stateimaging device, the configuration of a solid-state imaging device 41 ain which a readout gate 421 g′ for reading out signal charges from thephotoelectric conversion region 415 g for green is also provided to theinside of a penetrated trench 417 g′. With the semiconductor substratedevice 413, the penetration-shaped trenches 417 r and 417 g′ areprovided in a position sandwiching the photoelectric conversion regions415 r, 415 g, and 415 b. According to this configuration, the depths ofthe penetration-shaped trenches 417 r and 417 g′ as to the photoelectricconversion regions 415 r, 415 g, and 415 b stabilize, and accordingly,imaging properties without variation may be obtained.

Second Modification

FIG. 59B illustrates, as the second modification of the solid-stateimaging device, the configuration of a solid-state imaging device 41 bin which the readout gate 421 r for reading out signal charges from thephotoelectric conversion region 415 r for red also serves as a trench417 r′ which does not penetrate the semiconductor substrate 413. In thiscase, it is desirable to form the trench 417 r′ deeper than thephotoelectric conversion region 415 r for red.

Third Modification

FIG. 59C illustrates, as the third modification of the solid-stateimaging device, the configuration of a solid-state imaging device 41 cin which the potential adjustment region 425 r is provided to only thephotoelectric conversion region 415 r for red disposed in the deepestposition of the semiconductor substrate 413 farthest from the floatingdiffusion 423. In this case, let us say that the photoelectricconversion region 415 g for green is provided in proximity to the gateinsulating film 419 covering the inner wall of the trench 417 g. Evenwith such a configuration, the photoelectric conversion region 415 r forred is disposed in the deepest position of the semiconductor substrate413 farthest from the floating diffusion 423, and accordingly, all ofthe signal charges may be read out from the photoelectric conversionregion 415 r for red from which signal charges are read out with themost difficult situations. Note that, in the case of this configuration,all of the signals are arranged to be read out from the photoelectricconversion region 415 g for green by adjusting gate voltage to beapplied to the readout gate 421 g.

Note that this third modification may be combined with the first orsecond modification.

With the embodiments and modifications described above, theconfigurations have been described wherein the present technology hasbeen applied to a solid-state imaging device in which the readout gates421 r, 421 g, and 421 b, and the floating diffusion 423 are provided tothe light receiving face A side of the semiconductor substrate 413.However, the present technology may similarly be applied to what we calla rear face irradiation type solid-state imaging device wherein thereadout gates 421 r, 421 g, and 421 b, and the floating diffusion 423are provided on the face side opposite of the light receiving face A inthe semiconductor substrate 413. In this case, it is desirable toprovide a potential adjustment region so as to come into contact with aphotoelectric conversion region disposed in a deep position separatedfrom the floating diffusion 423.

Also, with the embodiments and modifications described above, theconfigurations have been described wherein the present technology hasbeen applied to a solid-state imaging device in which theelectroconductive types of the semiconductor substrate 413,photoelectric conversion regions 415 r, 415 g, and 415 b, and floatingdiffusion 423 are n types. However, the present technology may also beapplied to a solid-state imaging device having an electroconductive typeopposite thereof in the same way. In this case, it is desirable that “ntype” that has been described in the embodiments and modifications isread as “p type”, “p type” is read as “n type”, and further, “shallow”regarding the depth of potential is read as “deep”, and “deep” is readas “shallow”.

15. Embodiment of Electronic Device

Next, an embodiment of an electronic device having the above-describedsolid-state imaging devices will be described. The above-mentionedsolid-state imaging devices may be applied to electronic devices, forexample, such as camera systems such as digital cameras, video cameras,and so forth, cellular phones having an imaging function, other deviceshaving an imaging function, and so forth. FIG. 60 illustrates, as anexample of electronic devices, a schematic configuration in the case ofhaving applied the solid-state imaging device to a camera capable oftaking still images and moving images.

A camera 300 according to the present example includes a solid-stateimaging device 301, an optical system 302 for guiding incident light toa light reception sensor portion of the solid-state imaging device 301,a shutter device 303 provided between the solid-state imaging device 301and the optical system 302, and a driving circuit 304 for driving thesolid-state imaging device 301. Further, the camera 300 includes asignal processing circuit 305 for processing output signals from thesolid-state imaging device 301.

The solid-state imaging devices according to each of the embodimentsdescribed above is applied to the solid-state imaging device 301. Theoptical system (optical lens) 302 forms image light (incident light)from a subject on the imaging face (not illustrated) of the solid-stateimaging device 301. Thus, signal charges are accumulated within thesolid-state imaging device 301 for a certain period of time. Note thatthe optical system 302 may be configured of an optical lens groupincluding multiple optical lenses. Also, the shutter device 303 controlsa light irradiation period and a light shielding period of incidentlight as to the solid-state imaging device 301.

The driving circuit 304 supplies a driving signal to the solid-stateimaging device 301 and shutter device 303. The driving circuit 304controls the signal output operation as to the signal processing circuit305 of the solid-state imaging device 301, and the shutter operation ofthe shutter device 303 using the supplied driving signal. That is tosay, with this example, a signal transfer operation is performed fromthe solid-state imaging device 301 to the signal processing circuit 305using the driving signal (timing signal) supplied from the drivingcircuit 304.

The signal processing circuit 305 subjects the signal transferred fromthe solid-state imaging device 301 to various signal processes. Thesignal (video signal) subjected to various signal processes is stored ina storage medium (not illustrated) such as memory or the like, or outputto a monitor (not illustrated).

Note that, with the above solid-state imaging devices, though the firstelectroconductive type has been described as p type, and the secondelectroconductive type has been described as n type, theelectroconductive types of n type and p type may be reversed in thepresent technology. In this case, with the driving method, voltage to beapplied to various transfer transistors is replaced from positivevoltage to negative voltage.

Note that the present disclosure may also take the followingarrangements.

(1) A solid-state imaging device including: a first photodiode made upof a first first-electroconductive-type semiconductor region formed on afirst principal face side of a semiconductor substrate, and a firstsecond-electroconductive-type semiconductor region formed within thesemiconductor substrate adjacent to the firstfirst-electroconductive-type semiconductor region; a second photodiodemade up of a second first-electroconductive-type semiconductor regionformed on a second principal face side of the semiconductor substrate,and a second second-electroconductive-type semiconductor region formedwithin the semiconductor substrate adjacent to the secondfirst-electroconductive-type semiconductor region; and a gate electrodeformed on the first principal face side of the semiconductor substrate;wherein impurity concentration of a connection face between the secondfirst-electroconductive-type semiconductor region and the secondsecond-electroconductive-type semiconductor region is equal to orgreater than impurity concentration of a connection face of anopposite-side layer of the second first-electroconductive-typesemiconductor region of the second second-electroconductive-typesemiconductor region.

(2) The solid-state imaging device according to (1), further including:a third first-electroconductive-type semiconductor region between thefirst second-electroconductive-type semiconductor region and the secondsecond-electroconductive-type semiconductor region.

(3) The solid-state imaging device according to (1) or (2), furtherincluding: a second-electroconductive-type semiconductor region betweenthe first second-electroconductive-type semiconductor region and thesecond second-electroconductive-type semiconductor region, of which theimpurity concentration is lower than the impurity concentrations of thefirst second-electroconductive-type semiconductor region and the secondsecond-electroconductive-type semiconductor region.

(4) The solid-state imaging device according to any of (1) through (3),further including: a planar-type transfer transistor configured to readout the charges of the first photodiode formed on the first principalface of the semiconductor substrate; and a vertical-type transfertransistor configured to read out the charges of the second photodiodeformed on the first principal face of the semiconductor substrate.

(5) A solid-state imaging device including: a first photodiode made upof a first first-electroconductive-type semiconductor region formed on afirst principal face side of a semiconductor substrate, and a firstsecond-electroconductive-type semiconductor region formed within thesemiconductor substrate adjacent to the firstfirst-electroconductive-type semiconductor region; a second photodiodemade up of a second first-electroconductive-type semiconductor regionformed on a second principal face side of the semiconductor substrate,and a second second-electroconductive-type semiconductor region formedwithin the semiconductor substrate adjacent to the secondfirst-electroconductive-type semiconductor region; and a gate electrodeformed on the first principal face side of the semiconductor substrate;wherein the first second-electroconductive-type semiconductor region andthe second second-electroconductive-type semiconductor region isconnected within the semiconductor substrate, and impurity concentrationof a connection face between the second first-electroconductive-typesemiconductor region and the second second-electroconductive-typesemiconductor region is equal to or smaller than impurity concentrationof a connection face between the first second-electroconductive-typesemiconductor region and the second second-electroconductive-typesemiconductor region.

(6) A solid-state imaging device manufacturing method including:injecting a second-electroconductive-type impurity from the firstprincipal face side of a semiconductor substrate to form a firstsecond-electroconductive-type semiconductor region within the firstprincipal face side of the semiconductor substrate; injecting afirst-electroconductive-type impurity from the first principal face sideof the semiconductor substrate to form a firstfirst-electroconductive-type semiconductor region on the surface of thefirst principal face of the semiconductor substrate; forming a gateelectrode on the first principal face of the semiconductor substrate;injecting a second-electroconductive-type impurity from the secondprincipal face side of the semiconductor substrate to form a secondsecond-electroconductive-type semiconductor region within the secondprincipal face side of the semiconductor substrate, of which theimpurity concentration on the surface side of the second principal faceis equal to or greater than impurity concentration on the deep portionside of the semiconductor substrate; and injecting afirst-electroconductive-type impurity from the second principal faceside of the semiconductor substrate to form a secondfirst-electroconductive-type semiconductor region on the surface of thesecond principal face of the semiconductor substrate.

(7) The solid-state imaging device manufacturing method according to(6), further including: injecting a first-electroconductive-typeimpurity from the first principal face side to form a first pixelseparation from the surface of the first principal face side to theinside of the semiconductor substrate; and injecting afirst-electroconductive-type impurity from the second principal faceside to form a second pixel separation from the surface of the secondprincipal face side to a position where the first pixel separation isformed.

(8) An electronic device including: a solid-state imaging deviceaccording to any of (1) through (5); an optical system configured toguide incident light into an imaging unit of the solid-state imagingdevice; and a signal processing circuit configured to process an outputsignal of the solid-state imaging device.

(9) A solid-state imaging device including: a readout gate embeddedwithin a trench formed in a semiconductor substrate via a gateinsulating film; a photoelectric conversion region provided within thesemiconductor substrate; a floating diffusion provided on the surfacelayer of the semiconductor substrate while keeping an interval with thephotoelectric conversion region; and a potential adjustment regiondisposed adjacent to the photoelectric conversion region and the gateinsulating film, which is the same electroconductive type as thesemiconductor substrate and the photoelectric conversion region, andalso is an impurity region of which the electroconductive-typeconcentration is lower than those of this semiconductor substrate andthis photoelectric conversion region.

(10) The solid-state imaging device according to (9), wherein thepotential adjustment region is provided in the same depth position aswith the photoelectric conversion region.

(11) The solid-state imaging device according to (9) or (10), wherein aplurality of the photoelectric conversion regions are disposed by beinglaminated in the depth direction within the semiconductor substrate; andwherein the potential adjustment region is provided adjacent to aphotoelectric conversion region positioned farthest from the floatingdiffusion of the plurality of the photoelectric conversion regions.

(12) The solid-state imaging device according to (11), wherein of aplurality of the photoelectric conversion regions, a photoelectricconversion region provided adjacent to the potential adjustment regionis a photoelectric conversion region for red light.

(13) The solid-state imaging device according to any of (9) through(12), wherein the readout gate is disposed within a trench provided bypassing through the semiconductor substrate.

(14) The solid-state imaging device according to any of (9) through(13), wherein the floating diffusion is disposed on the light receivingface side as to the photoelectric conversion region in the semiconductorsubstrate.

(15) The solid-state imaging device according to any of (9) through(14), wherein the semiconductor substrate is configured of the sameelectroconductive type as the photoelectric conversion region and thefloating diffusion.

(16) The solid-state imaging device according to any of (9) through(15), wherein a pinning region having the opposite electroconductivetype of the photoelectric conversion region is provided within thesemiconductor substrate along the side wall of the trench; and whereinan overlapped region where the potential adjustment region and thepinning region are overlapped includes an impurity making up thispotential adjustment region and an impurity making up this pinningregion together.

(17) The solid-state imaging device according to (16), wherein a portionof the potential adjustment region is disposed overlapped with thepinning region.

(18) A solid-state imaging device manufacturing method including:introducing an impurity into a semiconductor substrate, thereby forminga photoelectric conversion region within this semiconductor substrate,and also forming a potential adjustment region adjacent to thisphotoelectric conversion region, which is the sameelectroconductive-type as this semiconductor substrate and thisphotoelectric conversion region, and also the electroconductive-typeconcentration is lower than those of this semiconductor substrate andthis photoelectric conversion region; forming a trench adjacent to thepotential adjustment region in the semiconductor substrate; forming areadout gate within the trench via a gate insulating film; and guidingan impurity into the surface layer of the semiconductor substrate,thereby forming a floating diffusion in proximity to the readout gate onthe surface layer of the semiconductor substrate.

(19) The solid-state imaging device manufacturing method according to(18), wherein the trench is formed by passing trough the semiconductorsubstrate.

(20) The solid-state imaging device manufacturing method according to(18) or (19), further including: introducing an impurity into thesemiconductor substrate from the inner wall of the trench after formingthe trench before forming the gate insulating film and the readout gate,thereby forming a pinning region having the opposite electroconductivetype of the photoelectric conversion region along the inner wall of thistrench.

(21) The solid-state imaging device manufacturing method according to(20), wherein, with formation of the pinning region, this pinning regionis overlapped with a portion of the potential adjustment region.

(22) An electronic device including: a readout gate embedded within atrench formed in a semiconductor substrate via a gate insulating film; aphotoelectric conversion region provided within the semiconductorsubstrate; a floating diffusion provided on the surface layer of thesemiconductor substrate while keeping an interval with the photoelectricconversion region; a potential adjustment region disposed adjacent tothe photoelectric conversion region and the gate insulating film, whichis the same electroconductive type as the semiconductor substrate andthe photoelectric conversion region, and also is an impurity region ofwhich the electroconductive-type concentration is lower than thissemiconductor substrate and this photoelectric conversion region; and anoptical system configured to guide incident light into the photoelectricconversion region.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A solid-state imaging device comprising: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of said semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of said semiconductor substrate; wherein impurity concentration of a connection face between said second first-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region is equal to or greater than impurity concentration of a connection face of an opposite-side layer of said second first-electroconductive-type semiconductor region of said second second-electroconductive-type semiconductor region.
 2. The solid-state imaging device according to claim 1, further comprising: a third first-electroconductive-type semiconductor region between said first second-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region.
 3. The solid-state imaging device according to claim 1, further comprising: a second-electroconductive-type semiconductor region between said first second-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region, of which the impurity concentration is lower than the impurity concentrations of said first second-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region.
 4. The solid-state imaging device according to claim 1, further comprising: a planar-type transfer transistor configured to read out the charges of said first photodiode formed on the first principal face of said semiconductor substrate; and a vertical-type transfer transistor configured to read out the charges of said second photodiode formed on the first principal face of said semiconductor substrate.
 5. A solid-state imaging device comprising: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of said semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of said semiconductor substrate; wherein said first second-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region are connected within said semiconductor substrate, and impurity concentration of a connection face between said second first-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region is equal to or smaller than impurity concentration of a connection face between said first second-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region.
 6. A solid-state imaging device manufacturing method comprising: injecting a second-electroconductive-type impurity from the first principal face side of a semiconductor substrate to form a first second-electroconductive-type semiconductor region within the first principal face side of said semiconductor substrate; injecting a first-electroconductive-type impurity from the first principal face side of said semiconductor substrate to form a first first-electroconductive-type semiconductor region on the surface of the first principal face of said semiconductor substrate; forming a gate electrode on the first principal face of said semiconductor substrate; injecting a second-electroconductive-type impurity from the second principal face side of said semiconductor substrate to form a second second-electroconductive-type semiconductor region within the second principal face side of said semiconductor substrate, of which the impurity concentration on the surface side of the second principal face is equal to or greater than impurity concentration on the deep portion side of said semiconductor substrate; and injecting a first-electroconductive-type impurity from the second principal face side of said semiconductor substrate to form a second first-electroconductive-type semiconductor region on the surface of the second principal face of said semiconductor substrate.
 7. The solid-state imaging device manufacturing method according to claim 6, further comprising: injecting a first-electroconductive-type impurity from the first principal face side to form a first pixel separation from the surface of the first principal face side to the inside of said semiconductor substrate; and injecting a first-electroconductive-type impurity from the second principal face side to form a second pixel separation from the surface of the second principal face side to a position where said first pixel separation is formed.
 8. An electronic device comprising: a solid-state imaging device including a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of said semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within said semiconductor substrate adjacent to said second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of said semiconductor substrate; wherein impurity concentration of a connection face between said second first-electroconductive-type semiconductor region and said second second-electroconductive-type semiconductor region is equal to or greater than impurity concentration of a connection face of an opposite-side layer of said second first-electroconductive-type semiconductor region of said second second-electroconductive-type semiconductor region; an optical system configured to guide incident light into an imaging unit of said solid-state imaging device; and a signal processing circuit configured to process an output signal of said solid-state imaging device.
 9. A solid-state imaging device comprising: a readout gate embedded within a trench formed in a semiconductor substrate via a gate insulating film; a photoelectric conversion region provided within said semiconductor substrate; a floating diffusion provided on the surface layer of said semiconductor substrate while keeping an interval with said photoelectric conversion region; and a potential adjustment region disposed adjacent to the photoelectric conversion region and said gate insulating film, which is the same electroconductive type as said semiconductor substrate and said photoelectric conversion region, and also is an impurity region of which the electroconductive-type concentration is lower than those of this semiconductor substrate and this photoelectric conversion region.
 10. The solid-state imaging device according to claim 9, wherein said potential adjustment region is provided in the same depth position as with said photoelectric conversion region.
 11. The solid-state imaging device according to claim 9, wherein a plurality of said photoelectric conversion regions are disposed by being laminated in the depth direction within said semiconductor substrate; and wherein said potential adjustment region is provided adjacent to a photoelectric conversion region positioned farthest from said floating diffusion of the plurality of said photoelectric conversion regions.
 12. The solid-state imaging device according to claim 11, wherein of a plurality of said photoelectric conversion regions, a photoelectric conversion region provided adjacent to said potential adjustment region is a photoelectric conversion region for red light.
 13. The solid-state imaging device according to claim 9, wherein said readout gate is disposed within a trench provided by passing through said semiconductor substrate.
 14. The solid-state imaging device according to claim 9, wherein said floating diffusion is disposed on the light receiving face as to said photoelectric conversion region in said semiconductor substrate.
 15. The solid-state imaging device according to claim 9, wherein said semiconductor substrate is configured of the same electroconductive type as said photoelectric conversion region and said floating diffusion.
 16. The solid-state imaging device according to claim 9, wherein a pinning region having the opposite electroconductive type of said photoelectric conversion region is provided within said semiconductor substrate along the side wall of said trench; and wherein an overlapped region where said potential adjustment region and said pinning region are overlapped includes an impurity making up this potential adjustment region and an impurity making up this pinning region together.
 17. The solid-state imaging device according to claim 16, wherein a portion of said potential adjustment region is disposed overlapped with said pinning region.
 18. A solid-state imaging device manufacturing method comprising: introducing an impurity into a semiconductor substrate, thereby forming a photoelectric conversion region within this semiconductor substrate, and also forming a potential adjustment region adjacent to this photoelectric conversion region, which is the same electroconductive-type as this semiconductor substrate and this photoelectric conversion region, and also the electroconductive-type concentration is lower than those of this semiconductor substrate and this photoelectric conversion region; forming a trench adjacent to said potential adjustment region in said semiconductor substrate; forming a readout gate within said trench via a gate insulating film; and guiding an impurity into the surface layer of said semiconductor substrate, thereby forming a floating diffusion in proximity to said readout gate on the surface layer of said semiconductor substrate.
 19. The solid-state imaging device manufacturing method according to claim 18, further comprising: introducing an impurity into said semiconductor substrate from the inner wall of said trench after forming said trench before forming said gate insulating film and said readout gate, thereby forming a pinning region having the opposite electroconductive type of said photoelectric conversion region along the inner wall of this trench.
 20. An electronic device comprising: a readout gate embedded within a trench formed in a semiconductor substrate via a gate insulating film; a photoelectric conversion region provided within said semiconductor substrate; a floating diffusion provided on the surface layer of said semiconductor substrate while keeping an interval with said photoelectric conversion region; a potential adjustment region disposed adjacent to the photoelectric conversion region and said gate insulating film, which is the same electroconductive type as said semiconductor substrate and said photoelectric conversion region, and also is an impurity region of which the electroconductive-type concentration is lower than this semiconductor substrate and this photoelectric conversion region; and an optical system configured to guide incident light into said photoelectric conversion region. 